1ST165EU1F50I2LG

The 1ST165EU1F50I2LG is an Intel Stratix® 10 TX Field Programmable Gate Array (FPGA) in a 2397-BBGA (FCBGA) package, offering 1,650,000 logic elements and 440 user I/O pins. It is an industrial-grade, surface-mount device specified for operation from −40 °C to 100 °C with a core voltage supply range of 820 mV to 880 mV.

As part of the Stratix 10 TX family, the device benefits from the family’s HyperFlex® core architecture, high-speed dual-mode transceivers, and hardened IP building blocks for high-bandwidth networking, PCIe interconnects, and demanding compute and communications applications.

Key Features

• Core & Process  HyperFlex® core architecture (Stratix 10 TX family) and Intel 14 nm tri-gate (FinFET) technology provide the architectural foundation for high-performance FPGA implementations.
• Logic Capacity  1,650,000 logic elements allow large digital designs and complex custom logic integration on a single device.
• On-chip Memory & DSP  Total on-chip RAM of 119,537,664 bits and support for variable-precision DSP blocks enable high-performance buffering, caching, and signal processing functions.
• High-speed Transceivers  Stratix 10 TX family transceivers support dual-mode operation (57.8 Gbps PAM4 and 28.9 Gbps NRZ), enabling chip-to-chip, chip-to-module, and backplane connectivity options.
• Hardened Interfaces  Family-level hardened IP includes PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC blocks to accelerate integration of common protocols.
• I/O & Package  440 I/O pins in a 2397-BBGA (FCBGA) package (supplier device package: 2397-FBGA, FC 50×50) in a surface-mount form factor for high-density board designs.
• Power & Thermal  Core supply specified 820 mV to 880 mV; industrial operating temperature range from −40 °C to 100 °C supports deployment in temperature-challenging environments.
• Configuration & Reliability  Stratix 10 TX family features device configuration options, secure device manager capabilities, and architecture elements designed to support robust system design and operation.
• Compliance  RoHS compliant.

Typical Applications

• High‑Speed Networking  Implement 10/25/100 Gbps Ethernet and high-bandwidth switching functions using the device’s hardened Ethernet MAC IP and high-rate transceivers.
• Data Center Switching and Routing  Aggregate high throughput and packet processing using large logic capacity and substantial on-chip RAM to support switching and routing pipelines.
• PCI Express Systems  Use the device’s hardened PCI Express Gen3 IP for server, storage, and accelerator interconnects requiring PCIe-based communication.
• Backplane and Chip‑to‑Chip Interfaces  Dual‑mode transceivers support PAM4 and NRZ signaling for high-speed backplane, chip-to-chip, and module-to-module links.

Unique Advantages

• High logic density: 1,650,000 logic elements provide the capacity to consolidate large FPGA designs and reduce external logic.
• Substantial on‑chip memory: 119,537,664 bits of RAM enable deep buffering and local data storage for streaming and packet-processing workloads.
• Flexible high‑speed connectivity: Dual‑mode transceivers and hardened Ethernet/PCIe IP simplify high-bandwidth interface integration and accelerate time to prototype.
• Industrial temperature support: Specified for −40 °C to 100 °C operation to meet thermal demands of rugged and industrial deployments.
• Advanced packaging and I/O density: 2397-BBGA FCBGA package with 440 I/O pins supports dense board-level integration in compact form factors.
• Regulatory friendliness: RoHS compliance supports environmental and regulatory requirements for many commercial and industrial applications.

Why Choose 1ST165EU1F50I2LG?

The 1ST165EU1F50I2LG delivers a balance of high logic capacity, significant on-chip RAM, and family-proven high-speed transceiver and hardened IP capabilities. Its industrial operating range, surface-mount FCBGA packaging, and RoHS compliance make it suitable for demanding communications, networking, and compute applications that require scalable programmable logic and reliable operation.

Engineers seeking to deploy large FPGA designs with high-throughput interfaces can leverage this device’s logic density, memory resources, and Stratix 10 TX family features to simplify system architecture and accelerate integration of complex protocols and high-speed links.

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