1ST165EU1F50I2VG
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 1650000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 676 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 440 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 206250 | Number of Logic Elements/Cells | 1650000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 119537664 |
Overview of 1ST165EU1F50I2VG – Stratix® 10 TX FPGA, 440 I/O, 1,650,000 Logic Elements, 2397-BBGA
The 1ST165EU1F50I2VG is an Intel Stratix 10 TX field programmable gate array (FPGA) in a 2397-ball FCBGA package. It combines a high-density programmable fabric with high-speed transceiver capability and hardened system-level building blocks to address demanding bandwidth and compute requirements.
Targeted at industrial and high-performance networking and communications applications, this device delivers 1,650,000 logic elements, 119,537,664 bits of internal RAM, and 440 device I/Os while operating across a core supply range of 770 mV to 970 mV and an operating temperature range of −40 °C to 100 °C.
Key Features
- High Logic Density — 1,650,000 logic elements provide ample programmable resources for complex FPGA designs and large-scale hardware acceleration.
- On‑chip Memory — 119,537,664 total RAM bits to support large buffering, packet processing, and intermediate data storage.
- High I/O Count — 440 I/O pins for flexible system interfacing and extensive connectivity options.
- Advanced Transceiver Architecture — Stratix 10 TX family transceiver technology supports dual-mode operation and industry-oriented high-speed serial links for chip-to-chip, chip-to-module, and backplane connections (series-level capability described in the device family documentation).
- Hardened System IP (Series Capability) — Family documentation references hardened IP such as PCI Express Gen3 and multi-rate Ethernet MACs suitable for high-throughput systems.
- Package and Mounting — 2397-BBGA FCBGA package (50 × 50 mm footprint) with surface-mount mounting type for dense board-level integration.
- Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
- Power Supply — Core voltage supply range of 770 mV to 970 mV for core power planning and thermal design.
- Compliance — RoHS-compliant manufacturing to meet environmental regulatory requirements.
Typical Applications
- High‑Speed Networking and Telecom — Leverage the device’s high logic density, large on‑chip RAM, and Stratix 10 TX transceiver capabilities for line cards, switching fabric, and packet-processing functions.
- Data Center Acceleration — Implement hardware acceleration for encryption, compression, and data-path offload where significant programmable logic and memory are required.
- Backplane and Module Interfaces — Use the device’s high I/O count and family transceiver features for chip‑to‑module and backplane connectivity in rack-mounted systems.
- Industrial Control and Test Equipment — Industrial temperature rating and extensive I/O make the device suitable for automation controllers, test instrumentation, and high-performance measurement systems.
Unique Advantages
- Large FPGA Fabric: 1,650,000 logic elements enable consolidation of multiple system functions into a single device, reducing board-level component count.
- Substantial On‑Chip Memory: Nearly 120 Mbit of RAM supports deep buffering and complex state machines without relying exclusively on external memory.
- High Connectivity: 440 I/Os accommodate wide parallel interfaces and multiple serial/transceiver endpoints for flexible system partitioning.
- Industrial‑Grade Operation: −40 °C to 100 °C operating range and surface-mount FCBGA packaging support deployment in rugged industrial environments.
- Power Planning Visibility: Defined core supply range (770 mV–970 mV) simplifies thermal and power-supply design for high-density implementations.
- Manufacturer Support: Backed by Intel’s Stratix 10 TX device family documentation and ecosystem resources for design and integration.
Why Choose 1ST165EU1F50I2VG?
The 1ST165EU1F50I2VG offers a high-density, industrial-grade Stratix 10 TX FPGA option for systems requiring significant programmable logic, large on-chip memory, and extensive I/O. Its FCBGA package and electrical/thermal characteristics make it suitable for demanding networking, data-center acceleration, and industrial control applications where integration and reliable operation across a wide temperature range are critical.
Designed as part of the Stratix 10 TX family, this device provides a platform that scales with complex system needs while aligning with established Intel FPGA documentation and support resources for development and deployment.
Request a quote or submit an inquiry to obtain pricing, availability, and additional technical support for the 1ST165EU1F50I2VG.

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