1ST165EU1F50I2VG

IC FPGA 440 I/O 2397BGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 1650000 2397-BBGA, FCBGA

Quantity 676 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O440Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs206250Number of Logic Elements/Cells1650000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits119537664

Overview of 1ST165EU1F50I2VG – Stratix® 10 TX FPGA, 440 I/O, 1,650,000 Logic Elements, 2397-BBGA

The 1ST165EU1F50I2VG is an Intel Stratix 10 TX field programmable gate array (FPGA) in a 2397-ball FCBGA package. It combines a high-density programmable fabric with high-speed transceiver capability and hardened system-level building blocks to address demanding bandwidth and compute requirements.

Targeted at industrial and high-performance networking and communications applications, this device delivers 1,650,000 logic elements, 119,537,664 bits of internal RAM, and 440 device I/Os while operating across a core supply range of 770 mV to 970 mV and an operating temperature range of −40 °C to 100 °C.

Key Features

  • High Logic Density — 1,650,000 logic elements provide ample programmable resources for complex FPGA designs and large-scale hardware acceleration.
  • On‑chip Memory — 119,537,664 total RAM bits to support large buffering, packet processing, and intermediate data storage.
  • High I/O Count — 440 I/O pins for flexible system interfacing and extensive connectivity options.
  • Advanced Transceiver Architecture — Stratix 10 TX family transceiver technology supports dual-mode operation and industry-oriented high-speed serial links for chip-to-chip, chip-to-module, and backplane connections (series-level capability described in the device family documentation).
  • Hardened System IP (Series Capability) — Family documentation references hardened IP such as PCI Express Gen3 and multi-rate Ethernet MACs suitable for high-throughput systems.
  • Package and Mounting — 2397-BBGA FCBGA package (50 × 50 mm footprint) with surface-mount mounting type for dense board-level integration.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
  • Power Supply — Core voltage supply range of 770 mV to 970 mV for core power planning and thermal design.
  • Compliance — RoHS-compliant manufacturing to meet environmental regulatory requirements.

Typical Applications

  • High‑Speed Networking and Telecom — Leverage the device’s high logic density, large on‑chip RAM, and Stratix 10 TX transceiver capabilities for line cards, switching fabric, and packet-processing functions.
  • Data Center Acceleration — Implement hardware acceleration for encryption, compression, and data-path offload where significant programmable logic and memory are required.
  • Backplane and Module Interfaces — Use the device’s high I/O count and family transceiver features for chip‑to‑module and backplane connectivity in rack-mounted systems.
  • Industrial Control and Test Equipment — Industrial temperature rating and extensive I/O make the device suitable for automation controllers, test instrumentation, and high-performance measurement systems.

Unique Advantages

  • Large FPGA Fabric: 1,650,000 logic elements enable consolidation of multiple system functions into a single device, reducing board-level component count.
  • Substantial On‑Chip Memory: Nearly 120 Mbit of RAM supports deep buffering and complex state machines without relying exclusively on external memory.
  • High Connectivity: 440 I/Os accommodate wide parallel interfaces and multiple serial/transceiver endpoints for flexible system partitioning.
  • Industrial‑Grade Operation: −40 °C to 100 °C operating range and surface-mount FCBGA packaging support deployment in rugged industrial environments.
  • Power Planning Visibility: Defined core supply range (770 mV–970 mV) simplifies thermal and power-supply design for high-density implementations.
  • Manufacturer Support: Backed by Intel’s Stratix 10 TX device family documentation and ecosystem resources for design and integration.

Why Choose 1ST165EU1F50I2VG?

The 1ST165EU1F50I2VG offers a high-density, industrial-grade Stratix 10 TX FPGA option for systems requiring significant programmable logic, large on-chip memory, and extensive I/O. Its FCBGA package and electrical/thermal characteristics make it suitable for demanding networking, data-center acceleration, and industrial control applications where integration and reliable operation across a wide temperature range are critical.

Designed as part of the Stratix 10 TX family, this device provides a platform that scales with complex system needs while aligning with established Intel FPGA documentation and support resources for development and deployment.

Request a quote or submit an inquiry to obtain pricing, availability, and additional technical support for the 1ST165EU1F50I2VG.

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