1ST165EU2F50E2VG

IC FPGA 440 I/O 2397BGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 1650000 2397-BBGA, FCBGA

Quantity 163 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O440Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs206250Number of Logic Elements/Cells1650000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits119537664

Overview of 1ST165EU2F50E2VG – Stratix® 10 TX FPGA, 1,650,000 logic elements, 440 I/Os

The 1ST165EU2F50E2VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) offered in an extended grade. It combines Intel's HyperFlex core architecture and family-level high-speed transceiver innovations to address high-bandwidth, compute-intensive system designs.

Suited for applications that require dense programmable logic, large on-chip memory, and multi-gigabit serial connectivity, this device delivers a mix of integration and performance for networking, data center, and advanced communications systems.

Key Features

  • Core Architecture  HyperFlex core architecture from the Stratix 10 TX family, designed to improve core performance relative to prior-generation high-performance FPGAs.
  • Logic Density  1,650,000 logic elements (LEs) to implement large-scale programmable functions and custom accelerators.
  • On-chip Memory  119,537,664 total RAM bits for buffering, packet processing, and intermediate data storage within the FPGA fabric.
  • Transceivers and Connectivity  Family-level dual-mode transceivers supporting 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation, and hardened IP for PCI Express Gen3 and high-rate Ethernet MACs.
  • I/O  440 user I/Os to interface with external devices, memory, and high-speed links.
  • Embedded Processing (Family Feature)  Select Stratix 10 TX devices include an embedded quad-core 64-bit Arm Cortex‑A53 Hard Processor System (HPS) for application-class processing; family-level documentation documents HPS availability in select parts.
  • Package & Mounting  2397-BBGA (FCBGA) package in a 50×50 supplier package footprint; surface-mount mounting type for standard board assembly.
  • Power Supply  Core voltage supply range of 770 mV to 970 mV as specified for the device.
  • Operating Temperature & Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C.
  • System & Security Capabilities (Family)  Family documentation references device configuration, secure device management, partial/dynamic reconfiguration, power management and device security features.

Typical Applications

  • High-speed Networking  Use the device's high-rate transceivers and hardened Ethernet MAC IP for line-rate packet processing and switching in networking equipment.
  • Data Center Interconnects  Leverage the device's aggregate transceiver bandwidth and dense logic to implement packet aggregation, forwarding, and protocol offload functions.
  • Backplane and Chip-to-Chip Links  Dual-mode transceivers (PAM4/NRZ) support chip-to-chip and backplane serial links for high-bandwidth board and system-level interconnects.
  • Compute Acceleration  Large logic capacity and abundant on-chip RAM enable custom accelerators and data-path implementations for specialized processing tasks.

Unique Advantages

  • High-density programmable fabric: 1,650,000 logic elements provide the capacity to implement complex logic and multi-function designs on a single device.
  • Large on-chip memory: 119,537,664 total RAM bits reduce external memory dependence for many buffering and stateful processing tasks.
  • Advanced serial connectivity: Family-level dual-mode transceivers support both PAM4 and NRZ signaling to accommodate diverse high-speed link requirements.
  • Integrated hardened IP (family-level): Hardened PCI Express Gen3 and high-rate Ethernet MAC IP blocks simplify system integration for common protocol stacks.
  • Broad I/O count: 440 I/Os enable flexible interfacing to peripherals, memories, and multi-lane high-speed links.
  • Scalable system option: Family features such as optional HPS and advanced packaging options provide a path to integrate processing and high-speed I/O in the same device family.

Why Choose 1ST165EU2F50E2VG?

The 1ST165EU2F50E2VG positions Stratix 10 TX capabilities—dense logic, substantial on-chip memory, extensive I/O, and family-level high-speed transceiver technology—into an extended-grade, surface-mount FCBGA package. It is suited to engineers designing high-bandwidth communications, data center, and compute-acceleration systems who need programmable logic with integrated high-speed connectivity.

Choosing this device provides a combination of performance and integration grounded in the Stratix 10 TX family architecture, supporting scalable designs that leverage on-chip memory and advanced transceivers while adhering to specified operating voltage and temperature ranges.

Request a quote or submit an inquiry to obtain pricing, availability, and additional technical support for 1ST165EU2F50E2VG.

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