1ST165EU2F50E2LG

The 1ST165EU2F50E2LG is an Intel Stratix® 10 TX field programmable gate array (FPGA) in a 2397-BBGA FCBGA package. It pairs a high-density programmable fabric with advanced I/O and transceiver capabilities for demanding, high-bandwidth system designs.

Built on the Stratix 10 TX series architecture, the device targets applications that require large logic capacity, substantial on-chip memory, and high-speed serial connectivity while offering extended-grade operating range and surface-mount packaging for system integration.

Key Features

• Core Architecture Intel HyperFlex® core architecture (Stratix 10 TX series) delivering enhanced core performance as described in the device overview.
• Logic Capacity 1,650,000 logic elements (cells), supporting large, complex designs and high gate density implementations.
• On‑Chip Memory 119,537,664 total RAM bits available for buffering, frame storage, and large state machines.
• I/O and Transceivers 440 general-purpose I/O pins and dual-mode transceiver technology in the Stratix 10 TX family capable of PAM4 and NRZ operation (series-level transceiver data rates up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ as described in the device overview).
• Embedded IP and Interfaces Series documentation highlights hardened IP including PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC with Reed‑Solomon FEC—available in the Stratix 10 TX family.
• Package and Mounting 2397-BBGA (FCBGA) package, supplier device package listed as 2397-FBGA, FC (50×50); surface mount for board-level integration.
• Power Core supply operating range specified at 820 mV to 880 mV for the device.
• Operating Range and Grade Extended grade with an operating temperature range of 0 °C to 100 °C; RoHS compliant.

Typical Applications

• High-bandwidth networking and data center — Use for line-rate packet processing and network acceleration leveraging the family’s hardened Ethernet MACs and high-speed transceivers.
• Storage and interconnect systems — Implement PCI Express interfaces and protocol offload in systems that require substantial logic and on-chip RAM.
• High-performance compute acceleration — Deploy large FPGA fabric and internal memory for custom data-paths, DSP pipelines, and algorithm acceleration.
• Backplane and chip-to-chip link designs — Dual‑mode transceivers in the Stratix 10 TX family support both PAM4 and NRZ serial links for board and module connectivity.

Unique Advantages

• High logic density: 1,650,000 logic elements provide extensive resources for complex, large-scale FPGA designs.
• Substantial on‑chip RAM: 119,537,664 bits of RAM enable deep buffering and large data structures without external memory dependence.
• Robust I/O complement: 440 programmable I/O pins accommodate wide parallel interfaces and flexible board-level connectivity.
• Advanced transceiver capability (family-level): Stratix 10 TX series dual-mode transceivers support high data-rate PAM4 and NRZ operation for modern link requirements.
• Production-ready packaging: 2397-BBGA FCBGA surface-mount package simplifies mechanical integration for high-density PCBs.
• Extended operating range: 0 °C to 100 °C operating temperature grade suits many commercial and extended-temperature deployments.

Why Choose 1ST165EU2F50E2LG?

The 1ST165EU2F50E2LG brings a combination of high logic capacity, large internal memory, and extensive I/O in a single Stratix 10 TX FCBGA package. Its specification set is suited to system designs that demand significant programmable fabric and high-throughput connectivity while maintaining an extended operating temperature window and RoHS compliance.

This device is well suited to design teams building networking, storage, and compute-acceleration solutions that need scalable FPGA resources and the advanced transceiver and IP capabilities described for the Stratix 10 TX family.

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