1ST165EU2F50I2LG

IC FPGA 440 I/O 2397BGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 1650000 2397-BBGA, FCBGA

Quantity 1,973 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O440Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs206250Number of Logic Elements/Cells1650000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits119537664

Overview of 1ST165EU2F50I2LG – Stratix® 10 TX FPGA, 1,650,000 Logic Elements, 440 I/O

The 1ST165EU2F50I2LG is an Intel Stratix® 10 TX field programmable gate array (FPGA) supplied in a 2397-BBGA FCBGA package. It pairs a high-density logic fabric—1,650,000 logic elements—with extensive on-chip RAM and a broad I/O complement to address demanding system designs.

Part of the Stratix 10 TX family, this device is built around Intel’s Hyperflex core architecture and heterogeneous packaging innovations, targeting applications that require high core performance, large memory resources, and substantial I/O and transceiver bandwidth.

Key Features

  • Core Architecture  Built on the Intel Hyperflex core architecture as described for Stratix 10 TX devices, delivering significant core performance for complex logic implementations.
  • Logic Capacity  1,650,000 logic elements (logic cells) to implement large-scale FPGA designs and high-density custom logic.
  • On‑Chip Memory  119,537,664 total RAM bits of on-chip memory for buffering, packet processing, and large local storage requirements.
  • I/O Density  440 dedicated I/O pins to support extensive board-level interfacing and parallel connectivity.
  • High‑Speed Transceiver Capability (Family)  Stratix 10 TX devices support dual‑mode transceivers (PAM4 and NRZ) up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ for chip-to-chip, chip-to-module, and backplane links.
  • Hard IP and Protocol Support (Family)  Family-level features include hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MACs with Reed‑Solomon FEC options for high-throughput protocol offload.
  • Package & Mounting  2397‑BBGA (FCBGA) supplier device package, 50 × 50 mm footprint; surface‑mount mounting type for high-density board assembly.
  • Power  Core supply voltage range of 820 mV to 880 mV as specified for the device.
  • Temperature & Grade  Industrial grade operation with an operating temperature range of −40°C to 100°C.
  • Standards & Compliance  RoHS‑compliant manufacturing status.

Typical Applications

  • High‑Performance Networking  Implement packet processing, line cards, and protocol offload where large logic capacity and on‑chip RAM accelerate throughput and buffering.
  • Telecom & Datacom Backplanes  Support chip‑to‑module and backplane links using family-level dual‑mode transceivers for high-speed serial connectivity.
  • Compute Acceleration  Large logic and memory resources enable custom accelerators and data‑path engines for compute‑intensive workloads.
  • System Integration & Prototyping  High I/O count and dense logic make the device suitable for complex system prototypes and advanced FPGA-based integration tasks.

Unique Advantages

  • High Logic Density:  1,650,000 logic elements provide headroom for large custom designs and multi‑function systems on a single FPGA.
  • Substantial On‑Chip Memory:  119,537,664 total RAM bits reduce external memory dependency and improve data locality for low‑latency processing.
  • Broad I/O Capability:  440 I/O pins allow flexible board routing and support for multiple high‑speed interfaces simultaneously.
  • Industrial Temperature Range:  Rated for −40°C to 100°C operation, enabling deployment in industrial environments requiring extended temperature tolerance.
  • Advanced Packaging:  2397‑BBGA FCBGA 50×50 package supports high‑density routing and reliable surface‑mount assembly for production systems.
  • Family‑Level High‑Speed Features:  Stratix 10 TX family innovations—Hyperflex core architecture, dual‑mode high‑speed transceivers, and hardened protocol IP—offer a platform designed for high‑bandwidth system requirements.

Why Choose 1ST165EU2F50I2LG?

The 1ST165EU2F50I2LG brings substantial logic capacity, large on‑chip memory, and a high I/O count in an industrial‑rated Stratix 10 TX device package. It is positioned for designs that demand scalable logic resources, robust memory for buffering and algorithms, and the ability to interface with multiple high‑speed links.

For engineering teams building high‑performance networking, telecom, compute acceleration, or complex integration platforms, this Stratix 10 TX device offers a balanced combination of density, memory, and I/O in a production‑ready package backed by Stratix 10 TX family features.

Request a quote for 1ST165EU2F50I2LG or submit an inquiry to obtain pricing, availability, and additional technical assistance for your project.

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