1ST165EU1F50I1VG

The 1ST165EU1F50I1VG is an Intel Stratix® 10 TX field programmable gate array supplied in a 2397‑BBGA FCBGA package. It pairs a high‑capacity programmable fabric of 1,650,000 logic elements with 119,537,664 bits of internal RAM and 440 I/O pins to address demanding, high‑bandwidth system designs in industrial environments.

Built on the Stratix 10 TX device family architecture described in the product documentation, this device targets applications that require dense logic, large on‑chip memory, extensive I/O and low core voltage operation while meeting industrial temperature and RoHS requirements.

Key Features

• Logic Fabric — 1,650,000 logic elements providing large-scale programmable logic capacity for complex FPGA implementations.
• On‑chip Memory — 119,537,664 total RAM bits for high-density buffering, caching and custom memory structures.
• I/O Capability — 440 user I/O pins to support a wide range of parallel interfaces and board-level connectivity.
• Transceiver & System Architecture (family level) — Stratix 10 TX family documentation describes dual‑mode transceivers and a high‑performance HyperFlex core architecture; use this device within designs that leverage the family’s transceiver and core innovations where applicable.
• Power Supply Range — Core voltage supply range 770 mV to 970 mV to accommodate low‑voltage, high‑performance FPGA operation.
• Package & Mounting — 2397‑BBGA (supplier package listed as 2397‑FBGA, FC 50×50) in a surface‑mount flip‑chip BGA format for high I/O density and board integration.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for industrial applications.
• Compliance — RoHS compliant.

Typical Applications

• High‑density networking equipment — Large logic capacity and substantial on‑chip RAM support packet processing, protocol offload and complex networking functions.
• Telecommunications and backplane interfaces — Extensive I/O and Stratix 10 TX family transceiver capabilities (per family documentation) enable high‑bandwidth board‑level and module interconnect designs.
• Data center acceleration — Dense logic and memory resources enable custom acceleration kernels and inline data processing in industrial data‑center environments.
• High‑performance embedded systems — The combination of high logic count, large RAM and low core voltage is suited to compute‑intensive industrial embedded applications.

Unique Advantages

• High programmable capacity: 1,650,000 logic elements enable complex, large‑scale hardware designs without immediate partitioning across multiple devices.
• Substantial on‑chip RAM: 119,537,664 bits of internal RAM reduce dependence on external memory for buffering and accelerate data‑intensive tasks.
• Extensive I/O: 440 I/O pins provide flexibility for parallel interfaces, board routing and system integration.
• Industrial readiness: −40 °C to 100 °C operating range and RoHS compliance address industrial application requirements.
• Compact, high‑density package: 2397‑BBGA FCBGA surface‑mount package delivers dense integration in space‑constrained designs.
• Low‑voltage core operation: 770 mV to 970 mV supply range supports high‑performance, power‑aware system designs.

Why Choose 1ST165EU1F50I1VG?

This Stratix 10 TX device brings a combination of very large logic capacity, sizable on‑chip RAM and broad I/O in a single 2397‑BBGA package, making it suitable for industrial systems that demand dense programmable logic and substantial memory resources. The device’s industrial temperature rating and RoHS compliance help ensure long‑term deployability in fielded equipment.

Choose 1ST165EU1F50I1VG when your design requires a high‑capacity FPGA fabric with significant local memory and I/O density, and when you want to leverage the Stratix 10 TX family’s architectural innovations as documented for high‑bandwidth, performance‑oriented applications.

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