1ST110ES3F50I3XG

The 1ST110ES3F50I3XG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) from Intel designed for applications requiring very large programmable logic capacity and on-chip memory. Built as a high-density FPGA device, it combines 1,325,000 logic elements with 112,197,632 total RAM bits and 440 I/Os to support complex digital systems and substantial data buffering on-chip.

Packaged in a 2397-BBGA (FCBGA) package with a 2397-FBGA supplier device package (50 × 50 mm), this industrial-grade, surface-mount device operates across a broad temperature range and uses a low-voltage core supply, making it suitable for industrial applications that demand robust thermal and electrical characteristics.

Key Features

• Core Logic Capacity — 1,325,000 logic elements (cells) for implementing large-scale programmable designs and complex custom logic.
• On-Chip Memory — 112,197,632 total RAM bits to support data buffering, state storage, and memory-intensive processing directly on the FPGA.
• I/O Density — 440 I/O pins to enable broad external connectivity for sensors, interfaces, and parallel data paths.
• Package and Mounting — 2397-BBGA, FCBGA package (supplier package: 2397-FBGA, FC 50×50) in a surface-mount form factor suitable for compact PCB designs.
• Voltage Supply — Core supply range of 870 mV to 970 mV, aligning with low-voltage FPGA core requirements.
• Operating Temperature — Industrial operating range from −40 °C to 100 °C for reliable performance in challenging environments.
• Regulatory — RoHS compliant.

Typical Applications

• Industrial Automation — Use in control systems and automation equipment where industrial-grade temperature range and large logic capacity support complex control algorithms and real-time processing.
• High-Capacity Data Processing — On-chip memory and abundant logic elements enable buffering and parallel processing tasks in data aggregation or preprocessing stages.
• I/O-Intensive Systems — High I/O count supports systems requiring many peripheral connections, sensor interfaces, or multi-channel I/O aggregation.

Unique Advantages

• Large Programmable Capacity: 1,325,000 logic elements provide the scale for complex, high-density designs without immediate external logic expansion.
• Substantial On-Chip Memory: 112,197,632 RAM bits enable significant data buffering and on-device storage to reduce external memory dependencies.
• High I/O Count: 440 I/Os facilitate extensive external connectivity, simplifying integration with many peripherals and interface standards.
• Industrial Reliability: Rated for −40 °C to 100 °C operation and supplied in a robust FCBGA package suitable for industrial deployments.
• Low-Voltage Core: Core supply range of 870 mV–970 mV supports designs targeting modern low-voltage FPGA architectures.
• RoHS Compliant: Meets RoHS requirements for environmental and regulatory compliance in assembly and manufacturing.

Why Choose 1ST110ES3F50I3XG?

The 1ST110ES3F50I3XG positions itself as a high-capacity, industrial-grade FPGA option for engineers deploying complex digital systems that demand substantial logic resources and on-chip memory. Its combination of 1,325,000 logic elements, 112,197,632 RAM bits, and 440 I/Os in a 2397-BBGA (FCBGA) package supports large designs while maintaining a compact surface-mount footprint.

This device is suited to customers and designs that require scalable programmable logic, significant on-device memory for buffering or processing, and reliable operation across industrial temperature ranges. As a component from Intel, it aligns with system architectures that prioritize integration density and operational robustness.

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