1ST110ES2F50I2VG

IC FPGA STRATIX10TX 2397FBGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 112197632 1325000 2397-BBGA, FCBGA

Quantity 1,131 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O440Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells1325000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits112197632

Overview of 1ST110ES2F50I2VG – Stratix® 10 TX FPGA, 1,325,000 logic elements

The 1ST110ES2F50I2VG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) IC by Intel designed for high-density, industrial applications. It combines 1,325,000 logic elements with 112,197,632 total RAM bits and 440 I/O to support complex, integrated digital designs.

Packaged in a 2397-BBGA FCBGA (50×50) surface-mount package and rated for an operating range of -40°C to 100°C, this device targets industrial environments that require large on-chip memory, extensive logic capacity, and broad I/O integration while conforming to RoHS requirements.

Key Features

  • Core Logic Capacity  Provides 1,325,000 logic elements to implement large-scale custom logic, parallel processing, and complex finite-state machines.
  • On-Chip Memory  112,197,632 total RAM bits for substantial on-chip buffering, frame storage, and state retention without relying solely on external memory.
  • I/O Resources  440 I/O pins to support extensive external interfacing, wide bus connections, and multiple parallel peripheral links.
  • Power Supply Range  Operational voltage supply range of 770 mV to 970 mV to match targeted core power and system rail requirements.
  • Package & Mounting  2397-BBGA (FCBGA) 50×50 supplier device package optimized for surface-mount assembly and dense board-level integration.
  • Industrial Temperature Grade  Rated to operate from -40°C to 100°C, supporting deployment in industrial temperature environments.
  • Regulatory Compliance  RoHS compliant, aligned with green manufacturing and regulatory expectations.

Typical Applications

  • Industrial Control Systems  Leverage the industrial temperature rating and extensive logic capacity to implement control algorithms, I/O aggregation, and real-time processing in factory and process environments.
  • Data Handling and Buffering  Use the 112,197,632 total RAM bits for on-chip buffering, packet staging, and dataflow management in high-throughput pipelines.
  • High-Density I/O Integration  Utilize 440 I/O pins and the 2397-BBGA package for complex board-level interfacing, wide parallel buses, and multi-channel connectivity.
  • Custom Compute and Acceleration  Deploy large arrays of logic elements and on-chip memory to implement application-specific acceleration and bespoke processing blocks.

Unique Advantages

  • Substantial Logic Resources: 1,325,000 logic elements enable complex, large-scale designs to be implemented on a single FPGA, reducing the need for multiple devices.
  • Large On-Chip Memory: 112,197,632 total RAM bits provide significant internal storage for buffers, look-up tables, and state machines, improving data locality and latency.
  • Extensive I/O Count: 440 I/O pins support broad external connectivity and simplify integration of multiple parallel interfaces on a single PCB.
  • Industrial Temperature Capability: Rated from -40°C to 100°C to meet demanding industrial-environment requirements without external thermal qualification steps.
  • Compact FCBGA Package: 2397-BBGA (50×50) surface-mount package provides a compact, high-pin-count form factor for dense system designs.
  • RoHS Compliant: Conforms to environmental compliance standards for streamlined manufacturing and regulatory alignment.

Why Choose 1ST110ES2F50I2VG?

The 1ST110ES2F50I2VG positions itself as a high-capacity, industrial-grade FPGA solution combining over a million logic elements, substantial on-chip RAM, and extensive I/O in a compact FCBGA package. These characteristics make it suitable for designs that require integrated logic, large local memory, and robust interfacing within industrial temperature environments.

For development teams and procurement focused on scalable, high-density FPGA implementations, this device offers a clear balance of logic capacity, memory resources, and board-level integration—backed by RoHS compliance to support manufacturing and supply-chain requirements.

Request a quote or submit a procurement inquiry to get pricing, lead-time, and availability information for the 1ST110ES2F50I2VG. Our team can provide the details you need to proceed with evaluation and integration.

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