1ST110ES2F50I2VG
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 112197632 1325000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 1,131 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 440 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 1325000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 112197632 |
Overview of 1ST110ES2F50I2VG – Stratix® 10 TX FPGA, 1,325,000 logic elements
The 1ST110ES2F50I2VG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) IC by Intel designed for high-density, industrial applications. It combines 1,325,000 logic elements with 112,197,632 total RAM bits and 440 I/O to support complex, integrated digital designs.
Packaged in a 2397-BBGA FCBGA (50×50) surface-mount package and rated for an operating range of -40°C to 100°C, this device targets industrial environments that require large on-chip memory, extensive logic capacity, and broad I/O integration while conforming to RoHS requirements.
Key Features
- Core Logic Capacity Provides 1,325,000 logic elements to implement large-scale custom logic, parallel processing, and complex finite-state machines.
- On-Chip Memory 112,197,632 total RAM bits for substantial on-chip buffering, frame storage, and state retention without relying solely on external memory.
- I/O Resources 440 I/O pins to support extensive external interfacing, wide bus connections, and multiple parallel peripheral links.
- Power Supply Range Operational voltage supply range of 770 mV to 970 mV to match targeted core power and system rail requirements.
- Package & Mounting 2397-BBGA (FCBGA) 50×50 supplier device package optimized for surface-mount assembly and dense board-level integration.
- Industrial Temperature Grade Rated to operate from -40°C to 100°C, supporting deployment in industrial temperature environments.
- Regulatory Compliance RoHS compliant, aligned with green manufacturing and regulatory expectations.
Typical Applications
- Industrial Control Systems Leverage the industrial temperature rating and extensive logic capacity to implement control algorithms, I/O aggregation, and real-time processing in factory and process environments.
- Data Handling and Buffering Use the 112,197,632 total RAM bits for on-chip buffering, packet staging, and dataflow management in high-throughput pipelines.
- High-Density I/O Integration Utilize 440 I/O pins and the 2397-BBGA package for complex board-level interfacing, wide parallel buses, and multi-channel connectivity.
- Custom Compute and Acceleration Deploy large arrays of logic elements and on-chip memory to implement application-specific acceleration and bespoke processing blocks.
Unique Advantages
- Substantial Logic Resources: 1,325,000 logic elements enable complex, large-scale designs to be implemented on a single FPGA, reducing the need for multiple devices.
- Large On-Chip Memory: 112,197,632 total RAM bits provide significant internal storage for buffers, look-up tables, and state machines, improving data locality and latency.
- Extensive I/O Count: 440 I/O pins support broad external connectivity and simplify integration of multiple parallel interfaces on a single PCB.
- Industrial Temperature Capability: Rated from -40°C to 100°C to meet demanding industrial-environment requirements without external thermal qualification steps.
- Compact FCBGA Package: 2397-BBGA (50×50) surface-mount package provides a compact, high-pin-count form factor for dense system designs.
- RoHS Compliant: Conforms to environmental compliance standards for streamlined manufacturing and regulatory alignment.
Why Choose 1ST110ES2F50I2VG?
The 1ST110ES2F50I2VG positions itself as a high-capacity, industrial-grade FPGA solution combining over a million logic elements, substantial on-chip RAM, and extensive I/O in a compact FCBGA package. These characteristics make it suitable for designs that require integrated logic, large local memory, and robust interfacing within industrial temperature environments.
For development teams and procurement focused on scalable, high-density FPGA implementations, this device offers a clear balance of logic capacity, memory resources, and board-level integration—backed by RoHS compliance to support manufacturing and supply-chain requirements.
Request a quote or submit a procurement inquiry to get pricing, lead-time, and availability information for the 1ST110ES2F50I2VG. Our team can provide the details you need to proceed with evaluation and integration.

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