1ST110ES2F50E2LG

The 1ST110ES2F50E2LG is an Intel Stratix® 10 TX Field Programmable Gate Array (FPGA) IC provided in a 2397-BBGA (FCBGA) surface-mount package. It delivers very high logic density and large embedded memory capacity in a compact 2397-FBGA, FC (50×50) supplier package.

Designed for designs that require substantial programmable logic, on-board RAM resources and extensive I/O, this extended-grade device targets applications where integration density, on-chip memory and high connectivity are key considerations.

Key Features

• Core — Logic Capacity 1,325,000 logic element cells provide a high-capacity programmable fabric for integrating complex digital functions.
• Memory Total RAM: 112,197,632 bits, supporting large buffering, state storage and memory-hungry logic implementations.
• I/O 440 I/O pins enable extensive external connectivity for interfaces, sensors and peripherals.
• Power Voltage supply range of 870 mV–970 mV to match low-voltage FPGA power rails.
• Package & Mounting 2397-BBGA, FCBGA package; supplier device package listed as 2397-FBGA, FC (50×50); surface mount for board-level integration.
• Operating Range & Grade Operating temperature 0°C–100°C with an Extended grade designation.
• Environmental Compliance RoHS compliant.

Typical Applications

• High-density logic implementations — Leverage 1,325,000 logic elements to consolidate multiple digital functions or complex accelerators into a single device.
• Memory-intensive designs — Use 112,197,632 bits of RAM for large buffers, packet processing or on-chip data handling without immediate reliance on external memory.
• I/O-rich systems — 440 I/O pins support extensive peripheral interfacing and multi-channel connectivity on a single FPGA.
• Board-level integration — Surface-mount 2397-BBGA (50×50) packaging enables dense PCB layouts for compact system designs.

Unique Advantages

• Highly integrated programmable fabric: Over a million logic elements allow complex system consolidation and reduced component count.
• Large embedded memory: 112,197,632 RAM bits decrease dependence on external memory, simplifying BOM and PCB routing.
• Broad connectivity: 440 I/O pins facilitate multiple parallel interfaces and sensor/IO expansion without external I/O controllers.
• Compact, production-ready package: 2397-BBGA (2397-FBGA, FC 50×50) surface-mount package supports modern PCB assembly and dense board designs.
• Extended operating range: 0°C–100°C operating temperature and Extended grade designation suit broader commercial environments.
• RoHS compliant: Meets lead-free assembly requirements for regulatory and manufacturing needs.

Why Choose 1ST110ES2F50E2LG?

The 1ST110ES2F50E2LG combines high logic density, substantial on-device RAM and a high I/O count in a compact FCBGA package, offering a balance of integration and connectivity for demanding digital designs. Its electrical and thermal specifications make it appropriate for systems that require large programmable resources and dense board-level implementation.

This device is well suited to engineers and teams developing complex FPGA-based solutions that benefit from consolidated logic, significant embedded memory and extensive external interfacing, with long-term value from a high-capacity, RoHS-compliant FPGA platform.

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