1ST110ES1F50I2VG

The 1ST110ES1F50I2VG is a Stratix® 10 TX field programmable gate array (FPGA) manufactured by Intel. It combines very large logic capacity, extensive on-chip RAM, and high I/O density in a 2397-ball FCBGA package for surface-mount assembly.

Designed for applications that require high integration and rugged operation, this device targets industrial designs that need substantial programmable logic, large RAM resources, and a broad operating temperature range.

Key Features

• Core Logic Density  Provides 1,325,000 logic element cells to implement complex digital systems and high-density logic functions.
• On-Chip Memory  Includes 112,197,632 total RAM bits for buffering, packet processing, and data staging within the FPGA fabric.
• I/O Capacity  Offers 440 I/O pins to support multiple external interfaces and high-pin-count board designs.
• Power Supply Range  Operates from 770 mV to 970 mV, allowing designs to target the specified core voltage window.
• Industrial Grade  Specified for industrial use with an operating temperature range of –40 °C to 100 °C for deployments in thermally demanding environments.
• Package & Mounting  Delivered in a 2397-BBGA (FCBGA) package; supplier device package listed as 2397-FBGA, FC (50×50). Surface mount mounting type supports standard PCB assembly processes.
• RoHS Compliant  Manufactured to meet RoHS requirements.

Typical Applications

• Industrial Control  High logic capacity and industrial temperature range enable implementation of control algorithms, motor drives, and supervisory logic in industrial equipment.
• Network & Communications Infrastructure  Large on-chip RAM and many I/O pins support packet buffering, protocol processing, and multiport interface designs.
• High-Density I/O Systems  Extensive I/O count makes the device suitable for systems requiring numerous parallel interfaces or high connector densities.
• Data Processing & Acceleration  Substantial logic and memory resources allow integration of custom data-paths, pre-processing, and acceleration blocks.

Unique Advantages

• High logic capacity: 1,325,000 logic element cells enable implementation of large, complex designs on a single device, reducing board-level partitioning.
• Large on-chip memory: 112,197,632 total RAM bits provide significant internal buffering and reduce dependence on external memory for many use cases.
• Broad I/O provisioning: 440 I/O pins accommodate multiple high-pin-count interfaces without external expansion.
• Industrial temperature range: Rated from –40 °C to 100 °C for reliability in thermally challenging deployments.
• Compact FCBGA footprint: 2397-ball FCBGA (50×50 supplier package) supports high-density PCB layouts while remaining surface-mount compatible.
• Regulatory compliance: RoHS compliance supports regulatory and environmental requirements.

Why Choose 1ST110ES1F50I2VG?

The 1ST110ES1F50I2VG positions itself for designs that demand substantial programmable logic, large embedded RAM, and extensive I/O in an industrial-grade package. Its combination of 1,325,000 logic element cells, 112,197,632 RAM bits, and 440 I/Os makes it suitable for consolidating complex functions onto a single FPGA, reducing system-level complexity.

Manufactured by Intel and supplied in a 2397-BBGA FCBGA surface-mount package, this device offers a balance of integration, thermal range, and assembly compatibility for engineering teams building robust, high-density embedded systems.

Request a quote or submit a purchase inquiry to evaluate the 1ST110ES1F50I2VG for your next high-density FPGA design.