1ST110ES1F50E2LG

The 1ST110ES1F50E2LG is a Stratix® 10 TX field programmable gate array (FPGA) from Intel, delivered in a 2397-BBGA (FCBGA) surface-mount package. It provides high logic density and large on-chip RAM capacity for complex digital designs that require substantial programmable logic and memory resources.

With 1,325,000 logic elements, 112,197,632 total RAM bits, and 440 I/O, this device targets designs that demand extensive logic integration and significant internal memory while operating within an 870 mV to 970 mV supply range and an extended temperature window of 0 °C to 100 °C.

Key Features

• Logic Capacity — 1,325,000 logic elements, enabling large-scale programmable logic implementations.
• On‑chip Memory — 112,197,632 total RAM bits to support data buffering, lookup tables, and embedded memory needs.
• I/O Resources — 440 available I/Os to support wide interfacing and multiple parallel connections.
• Package and Mounting — 2397-BBGA, FCBGA package (supplier package: 2397-FBGA, FC (50x50)); surface-mount mounting type for board-level integration.
• Power Supply Range — Operates from 870 mV to 970 mV, allowing design within a defined low-voltage supply window.
• Operating Range and Grade — Extended grade with an operating temperature range of 0 °C to 100 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-density FPGA designs — Use where large numbers of logic elements are required to implement complex logic, state machines, and custom datapaths.
• Memory-intensive functions — Suitable for designs that need substantial internal RAM for buffering, pattern storage, or on-chip data structures, based on its 112,197,632 total RAM bits.
• I/O-heavy systems — Ideal for applications requiring up to 440 I/O pins for parallel interfaces, sensor arrays, or multi‑channel data paths.
• Board-level integration — The 2397-BBGA surface-mount package supports compact placement in systems where a high-density BGA is required.

Unique Advantages

• Massive programmable logic: 1,325,000 logic elements allow consolidation of large logic functions into a single FPGA, reducing the need for multiple devices.
• Large internal RAM: 112,197,632 total RAM bits provide the on-chip memory footprint needed for buffering, FIFOs, and embedded data storage without external memory in some designs.
• High I/O count: 440 I/Os enable complex interfacing and parallel connectivity to peripherals, sensors, and external logic.
• Compact BGA package: 2397-BBGA (2397-FBGA, FC (50x50)) surface-mount format supports high-density PCB layouts and reliable solder-mounted deployment.
• Defined low-voltage operation: 870 mV to 970 mV supply range supports designs targeting low-voltage domains.
• Extended operational range: Extended grade with 0 °C to 100 °C operating temperature gives predictable behavior across typical commercial-to-extended ambient conditions.
• Regulatory compliance: RoHS compliance aids integration into products requiring lead-free component selection.

Why Choose 1ST110ES1F50E2LG?

The 1ST110ES1F50E2LG positions itself as a high-density Stratix® 10 TX FPGA platform offering a balance of vast logic capacity, significant on-chip memory, and substantial I/O resources in a compact 2397-BBGA surface-mount package. Its extended grade and defined supply and temperature ranges make it suitable for designs that require predictable behavior across a broad operating window.

This device is well suited to engineers and system designers building complex digital systems that demand integration of large logic networks and substantial internal memory while retaining high I/O connectivity. The combination of capacity, package density, and RoHS compliance supports scalable designs and streamlined component selection.

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