1ST110ES1F50E2VG

The 1ST110ES1F50E2VG is a Stratix® 10 TX field programmable gate array (FPGA) IC from Intel. It provides a high logic-density FPGA fabric with substantial on-chip RAM and a large I/O count in a FCBGA package.

With 1,325,000 logic elements, 112,197,632 total RAM bits and 440 I/O, this device is intended for designs that require significant programmable logic capacity, large embedded memory, and numerous external interfaces while meeting an extended operating grade.

Key Features

• Logic Capacity  1,325,000 logic elements for implementing large-scale programmable logic and complex designs.
• On‑Chip Memory  112,197,632 total RAM bits to support memory-intensive functions and data buffering on the device.
• I/O  440 I/O pins to accommodate high pin-count interfaces and multi-channel connectivity requirements.
• Power Supply Range  Operational voltage range from 770 mV to 970 mV, enabling integration with power rails in modern FPGA power architectures.
• Package and Mounting  2397‑BBGA (FCBGA) package, supplier device package 2397‑FBGA, FC (50×50); surface-mount mounting for board-level integration.
• Temperature and Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for deployments that require above-ambient operating capability.
• Compliance  RoHS compliant.

Typical Applications

• High‑density FPGA Systems  Large logic capacity supports complex programmable logic functions and system-level integration.
• Memory‑intensive Processing  Extensive on‑chip RAM enables buffering, packet processing, and data‑flow applications that require significant embedded memory.
• Multi‑I/O Interface Designs  440 I/O pins allow support for multiple high‑pin-count interfaces and peripheral connectivity on a single device.
• Board‑level Integration  Surface-mount FCBGA packaging (50×50) suited for compact, high‑density board layouts.

Unique Advantages

• Significant logic density: 1,325,000 logic elements reduce the need to partition designs across multiple devices.
• Large embedded memory: 112,197,632 RAM bits provide on-chip capacity for buffering and local data storage, simplifying external memory requirements.
• High I/O count: 440 I/O pins support complex multi‑channel and multi‑interface systems without additional bridging components.
• Compact, board-ready package: 2397‑BBGA FCBGA package and surface-mount mounting enable high-density PCB designs.
• Extended operating range: 0 °C to 100 °C grade suited for applications requiring above‑ambient operation.
• Regulatory compliance: RoHS compliance supports environmentally constrained designs and manufacturing requirements.

Why Choose 1ST110ES1F50E2VG?

The 1ST110ES1F50E2VG positions itself as a high-capacity, memory-rich FPGA solution in a compact FCBGA package. Its combination of 1,325,000 logic elements, over 112 million RAM bits, and 440 I/O makes it suitable for designs that consolidate complex logic, large on‑chip data stores, and extensive external connectivity into a single device.

As an Intel Stratix® 10 TX device offered in an extended grade and RoHS‑compliant package, it delivers a balance of integration and operational range for engineers targeting scalable, high‑density FPGA implementations.

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