1ST110ES1F50I1VG

The 1ST110ES1F50I1VG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) IC supplied in a 2397-BBGA FCBGA surface-mount package. It is an industrial-grade device specified for operation from -40 °C to 100 °C.

This device delivers substantial on-chip resources, including 1,325,000 logic elements and 112,197,632 total RAM bits, together with 440 I/Os and a core voltage range of 770 mV–970 mV, enabling complex logic, high-capacity buffering, and dense I/O integration in compact board designs.

Key Features

• Core / Logic Capacity  1,325,000 logic elements (cells) provide the raw programmable fabric needed for large-scale custom logic implementations.
• On-Chip Memory  112,197,632 total RAM bits supply significant embedded storage for buffering, state machines, and algorithm working sets.
• I/O Density  440 general-purpose I/Os support extensive peripheral interfacing and multi-channel connectivity.
• Voltage Supply Range  Core supply specified from 770 mV to 970 mV, enabling designs that align with targeted power-rail architectures.
• Package & Mounting  2397-BBGA, FCBGA package (supplier device package: 2397-FBGA, FC (50×50)) in a surface-mount form factor for high pin density in constrained PCB footprint.
• Industrial Temperature & Grade  Industrial-grade device rated for operation from -40 °C to 100 °C for use in temperature-demanding environments.

Typical Applications

• Signal processing and acceleration  Large logic and memory resources support implementation of complex, application-specific processing pipelines and data-path acceleration.
• High-density I/O aggregation  440 I/Os enable consolidation of multiple interfaces and peripheral channels on a single FPGA for board-level integration.
• Embedded compute and control  Industrial temperature rating and high resource counts suit demanding embedded control and compute tasks in rugged deployments.

Unique Advantages

• High logic integration: 1,325,000 logic elements allow designers to implement large-scale custom architectures without partitioning across multiple devices.
• Substantial on-chip memory: 112,197,632 RAM bits reduce dependence on external memory for many buffering and state-storage needs, simplifying BOM and board layout.
• Extensive I/O capability: 440 I/Os provide flexibility to connect numerous interfaces, sensors, or high-channel-count peripherals directly to the FPGA.
• Industrial robustness: Rated -40 °C to 100 °C and supplied in a 2397-BBGA FCBGA package for reliable operation in harsh environments.
• Compact, high-density package: Surface-mount 2397-BBGA (2397-FBGA, FC (50×50)) offers a space-efficient solution with high pin count for complex designs.
• Defined core voltage window: 770 mV–970 mV supply range supports tight power rail design and integration with modern power architectures.

Why Choose 1ST110ES1F50I1VG?

The 1ST110ES1F50I1VG delivers a combination of large programmable logic capacity, significant on-chip memory, and high I/O density in an industrial-grade, surface-mount package. These characteristics make it suitable for designs that require substantial custom logic, extensive buffering, and numerous peripheral connections while operating across a wide temperature range.

For engineering teams building high-density FPGA-based systems, this device offers a scalable hardware substrate that consolidates functionality and helps reduce board-level complexity and component count.

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