1ST110EN3F43I3VGAS

The 1ST110EN3F43I3VGAS is an Intel Stratix® 10 TX field‑programmable gate array (FPGA) in a 1760‑BBGA (FCBGA) package. It combines a high‑capacity FPGA fabric with the Stratix 10 TX device family innovations to address designs that require large logic capacity, substantial on‑chip RAM, and high‑speed I/O.

Targeted at high‑bandwidth systems, this device leverages the Stratix 10 TX architecture—including the HyperFlex® core and heterogeneous transceiver technology—to deliver scalable programmable logic, dense internal memory, and extensive I/O for demanding communications and compute applications.

Key Features

• Core Logic  1,100,000 logic elements provide large programmable fabric capacity for complex logic integration and custom accelerators.
• Memory  112,197,632 total RAM bits of on‑chip memory to support buffering, lookup tables, and data‑path storage.
• High‑Speed Transceivers (Stratix 10 TX family)  Family dual‑mode transceivers support PAM4 up to 57.8 Gbps and NRZ up to 28.9 Gbps for high‑bandwidth chip‑to‑chip, module, and backplane links.
• Hard IP and Protocol Support  Stratix 10 TX devices include hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC implementations in the device family for system‑level protocol integration.
• I/O and Package  440 device I/O pins in a 1760‑BBGA (FCBGA) form factor; supplier package dimension listed as 1760‑FBGA (42.5 × 42.5 mm).
• Power Supply Range  Core supply operating range of 770 mV to 970 mV, enabling target power and performance tradeoffs.
• Operating Temperature  Industrial temperature range from −40 °C to 100 °C suitable for demanding environments.
• Packaging and Integration  Implemented using Stratix 10 TX family packaging innovations such as heterogeneous 3D SiP transceiver tiles and EMIB‑style integration referenced in the device family overview.

Typical Applications

• High‑bandwidth networking equipment  Use the device’s high logic capacity, large on‑chip RAM, and family transceivers to implement packet processing, Ethernet MAC offload, and line‑rate data paths.
• Data center acceleration  Large logic resources and dense internal memory enable custom acceleration for compute and storage workloads requiring flexible hardware implementation.
• Telecommunications infrastructure  Leverage the Stratix 10 TX family transceiver capabilities and hardened protocol IP for backplane, module, and chip‑to‑chip links in telecom systems.
• High‑performance test and measurement  Combine extensive I/O count and programmable fabric to build flexible signal processing and data acquisition systems.

Unique Advantages

• High programmable capacity: 1,100,000 logic elements give designers room to implement complex algorithms, large state machines, and hardware accelerators on one device.
• Substantial on‑chip memory: Over 112 million bits of RAM reduce dependence on external memory for buffering and intermediate storage.
• Family‑level high‑speed I/O: Stratix 10 TX dual‑mode transceivers and hardened Ethernet/PCIe IP (as available in the family) streamline integration of high‑bandwidth interfaces.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in temperature‑challenging installations.
• Compact, high‑density packaging: 1760‑BBGA (FCBGA) package with a 42.5 × 42.5 mm footprint (supplier package) enables dense system integration.
• Power configurability: Core supply range of 770 mV–970 mV provides flexibility for power/performance tuning.

Why Choose 1ST110EN3F43I3VGAS?

This Stratix 10 TX FPGA provides a balance of large programmable fabric, extensive on‑chip RAM, and a high I/O count in a compact 1760‑BBGA package, making it suitable for systems that require significant custom logic alongside high‑speed interfaces. Its industrial temperature rating and defined power range make it applicable for demanding deployments where reliability and thermal margin matter.

The device aligns with designs that need scalable logic capacity and bandwidth while leveraging the Stratix 10 TX family architecture and hardened IP elements referenced in the device overview. It is appropriate for engineers building advanced networking, compute acceleration, and communications systems that require a high degree of integration and programmable flexibility.

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