1ST110EN2F43I2VGAS
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 1100000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,447 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 440 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 137500 | Number of Logic Elements/Cells | 1100000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 112197632 |
Overview of 1ST110EN2F43I2VGAS – Stratix® 10 TX FPGA, 1,100,000 logic elements, 440 I/O
The 1ST110EN2F43I2VGAS is an Intel Stratix® 10 TX field programmable gate array (FPGA) offered in a 1760-FBGA (42.5 × 42.5 mm) package configured for industrial-grade operation. It combines a high-density monolithic core fabric with advanced transceiver tiles and hardened IP to address demanding, high-bandwidth system designs.
Built on Intel 14 nm tri-gate (FinFET) technology with the HyperFlex® core architecture, this device targets applications that require large programmable logic capacity, extensive embedded RAM, and high-speed serial connectivity while operating across a wide industrial temperature range.
Key Features
- Core & Architecture HyperFlex® core architecture and Intel 14 nm tri-gate (FinFET) implementation for increased core performance as documented for the Stratix 10 TX family.
- Logic Capacity 1,100,000 logic elements (logic cells) to support large, complex designs and high-density FPGA implementations.
- Embedded Memory 112,197,632 total RAM bits available for on-chip buffering, packet processing, and algorithm implementation.
- High‑Speed Transceivers Dual‑mode transceivers capable of 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation, suitable for chip‑to‑chip, chip‑to‑module, and backplane links as described for Stratix 10 TX devices.
- Hardened Interface IP Includes hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks as part of the Stratix 10 TX feature set.
- I/O and Packaging 440 user I/O pins and a 1760-BBGA / 1760-FBGA package (42.5 × 42.5 mm) for dense system integration.
- Power Supply Core voltage range specified at 770 mV to 970 mV for device power planning and regulator selection.
- Industrial Temperature Grade Rated for operation from −40°C to 100°C, supporting industrial deployment scenarios.
- Standards Compliance RoHS compliant for environmental compliance in applicable designs.
Typical Applications
- High-Speed Networking Implements line-rate packet processing and MAC layers using hardened 10/25/100 Gbps Ethernet IP and extensive on-chip memory.
- Telecom and Data Center Interconnect Supports backplane, chip‑to‑chip, and chip‑to‑module links with dual‑mode transceivers operating up to 57.8 Gbps PAM4.
- PCI Express-Based Systems Integrates hardened PCIe Gen3 IP for high-throughput host or peripheral interfaces in compute and storage systems.
- Compute Acceleration Large logic and RAM resources enable implementation of custom accelerators and DSP pipelines within the FPGA fabric.
Unique Advantages
- High Logic Density: 1,100,000 logic elements provide the capacity needed for complex SoC-style designs and large custom logic implementations.
- Integrated High-Speed I/O: Dual-mode transceivers with PAM4 and NRZ support enable flexible deployment across modern high-bandwidth interconnects.
- Hardened Interface Blocks: Built-in PCIe Gen3 and high-speed Ethernet MAC IP reduce development time and offload common protocol functions from custom logic.
- Substantial On-Chip Memory: Over 112 million bits of RAM for packet buffering, state storage, and algorithmic data processing without external memory access.
- Industrial Temperature Support: −40°C to 100°C operating range for reliable operation in industrial environments.
- Compact High-Density Packaging: 1760-FBGA package with 440 I/O contacts supports dense board-level integration while preserving a large I/O count.
Why Choose 1ST110EN2F43I2VGAS?
The 1ST110EN2F43I2VGAS combines a high-performance HyperFlex® fabric with extensive on-chip memory and high‑speed transceivers to meet the needs of bandwidth‑intensive, logic‑heavy applications. Its industrial temperature rating, RoHS compliance, and compact 1760-FBGA package make it suitable for demanding system deployments that require reliability and integration.
This device is aimed at system designers who require scalable FPGA capacity, hardened interface IP, and flexible transceiver options for networking, telecom, compute acceleration, and other high‑performance embedded systems. The integration of logic, memory, and hardened IP reduces board-level complexity and supports long-term system scalability within the Stratix® 10 TX device family.
Request a quote or submit an inquiry to receive pricing and availability for the 1ST110EN2F43I2VGAS. Our team can provide ordering details and lead-time information to support your design schedule.

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