1ST110EN2F43I2LGAS
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 1100000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 248 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 440 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 137500 | Number of Logic Elements/Cells | 1100000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 112197632 |
Overview of 1ST110EN2F43I2LGAS – Stratix® 10 TX FPGA, 1,100,000 logic elements, 440 I/Os, 1760-BBGA
The 1ST110EN2F43I2LGAS is an Intel Stratix® 10 TX field programmable gate array (FPGA) supplied in a 1760-BBGA (1760-FBGA, 42.5×42.5) package for surface-mount assembly. This industrial-grade device integrates a high-density FPGA fabric with 1,100,000 logic elements and 112,197,632 bits of on-chip RAM to address demanding bandwidth- and compute-intensive applications.
Stratix 10 TX devices offer series-level innovations such as the Intel Hyperflex core architecture and high‑speed dual‑mode transceivers, enabling system designs that require high aggregate bandwidth and flexible protocol support.
Key Features
- Core Architecture Built on the Stratix 10 TX family with Intel Hyperflex core architecture to deliver enhanced core performance at the device series level.
- Logic Density 1,100,000 logic elements provide a large programmable fabric for complex logic, control, and acceleration functions.
- On‑Chip Memory 112,197,632 total RAM bits support large buffers, packet processing, and data‑intensive algorithms directly on chip.
- High‑Speed I/O 440 I/Os and series-capable transceivers (Stratix 10 TX devices support dual‑mode 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation) for high-bandwidth serial interfacing.
- Transceiver Capacity Stratix 10 TX family supports up to 144 full-duplex transceiver channels for multi-lane serial links and backplane applications.
- Hard IP and Protocol Support Series-level hardened IP includes PCI Express Gen3 and 10/25/100 Gbps Ethernet MACs with dedicated FEC options.
- Power and Voltage Core voltage supply range of 820 mV to 880 mV for the device core power rails.
- Package and Mounting 1760-BBGA (1760-FBGA, 42.5×42.5) package, surface mount, suitable for high-density board designs.
- Operating Range Industrial operating temperature from −40 °C to 100 °C for reliable performance in thermally demanding environments.
- Configuration and Device Management Series documentation includes device configuration and Secure Device Manager (SDM) capabilities for secure configuration and management.
Typical Applications
- High‑Performance Networking Used in 10/25/100 Gbps Ethernet switching and routing platforms where large logic capacity and high aggregate bandwidth are required.
- Telecommunications and Optical Transport Suitable for backplane and chip‑to‑module interfaces leveraging the family’s high‑speed transceivers and FEC‑enabled Ethernet MACs.
- Compute Acceleration On‑device RAM and dense logic enable hardware acceleration for DSP, packet processing, and custom compute kernels.
- Data Center Infrastructure Applicable to high‑bandwidth aggregation, PCI Express bridging, and modular I/O subsystems in data center equipment.
Unique Advantages
- High logic and memory integration: 1,100,000 logic elements and over 112 million RAM bits reduce the need for external memory and support complex on‑chip processing.
- Flexible high‑speed connectivity: Dual‑mode transceiver support and up to 144 transceiver channels at the series level enable versatile protocol and physical-layer interfaces.
- Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in thermally challenging and industrial environments.
- Compact, high‑density package: 1760‑FBGA (42.5×42.5) package provides a high pin‑count solution in a compact footprint for dense system boards.
- Power‑aware core supply: Core voltage range of 820–880 mV allows designers to align power delivery and thermal planning with device requirements.
- Series-level hardened IP: Built‑in support for PCIe Gen3 and 10/25/100 GbE MACs streamlines implementation of standard interfaces.
Why Choose 1ST110EN2F43I2LGAS?
The 1ST110EN2F43I2LGAS brings the Stratix 10 TX family’s high-density programmable fabric and series-level high-speed transceiver capabilities into an industrial-grade FPGA package. Its combination of 1,100,000 logic elements, extensive on‑chip RAM, and a 440‑pin I/O count makes it suited for systems that demand substantial on‑chip processing, large buffers, and robust I/O connectivity.
This device is ideal for engineers building high‑bandwidth networking, telecommunications, and compute acceleration platforms who require a scalable, high‑integration FPGA with documented series-level features such as hardened PCIe and Ethernet MAC IP, advanced transceiver modes, and secure configuration facilities.
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