1ST110EN2F43I2LGAS

IC FPGA 440 I/O 1760FBGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 1100000 1760-BBGA, FCBGA

Quantity 248 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O440Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs137500Number of Logic Elements/Cells1100000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits112197632

Overview of 1ST110EN2F43I2LGAS – Stratix® 10 TX FPGA, 1,100,000 logic elements, 440 I/Os, 1760-BBGA

The 1ST110EN2F43I2LGAS is an Intel Stratix® 10 TX field programmable gate array (FPGA) supplied in a 1760-BBGA (1760-FBGA, 42.5×42.5) package for surface-mount assembly. This industrial-grade device integrates a high-density FPGA fabric with 1,100,000 logic elements and 112,197,632 bits of on-chip RAM to address demanding bandwidth- and compute-intensive applications.

Stratix 10 TX devices offer series-level innovations such as the Intel Hyperflex core architecture and high‑speed dual‑mode transceivers, enabling system designs that require high aggregate bandwidth and flexible protocol support.

Key Features

  • Core Architecture  Built on the Stratix 10 TX family with Intel Hyperflex core architecture to deliver enhanced core performance at the device series level.
  • Logic Density  1,100,000 logic elements provide a large programmable fabric for complex logic, control, and acceleration functions.
  • On‑Chip Memory  112,197,632 total RAM bits support large buffers, packet processing, and data‑intensive algorithms directly on chip.
  • High‑Speed I/O  440 I/Os and series-capable transceivers (Stratix 10 TX devices support dual‑mode 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation) for high-bandwidth serial interfacing.
  • Transceiver Capacity  Stratix 10 TX family supports up to 144 full-duplex transceiver channels for multi-lane serial links and backplane applications.
  • Hard IP and Protocol Support  Series-level hardened IP includes PCI Express Gen3 and 10/25/100 Gbps Ethernet MACs with dedicated FEC options.
  • Power and Voltage  Core voltage supply range of 820 mV to 880 mV for the device core power rails.
  • Package and Mounting  1760-BBGA (1760-FBGA, 42.5×42.5) package, surface mount, suitable for high-density board designs.
  • Operating Range  Industrial operating temperature from −40 °C to 100 °C for reliable performance in thermally demanding environments.
  • Configuration and Device Management  Series documentation includes device configuration and Secure Device Manager (SDM) capabilities for secure configuration and management.

Typical Applications

  • High‑Performance Networking  Used in 10/25/100 Gbps Ethernet switching and routing platforms where large logic capacity and high aggregate bandwidth are required.
  • Telecommunications and Optical Transport  Suitable for backplane and chip‑to‑module interfaces leveraging the family’s high‑speed transceivers and FEC‑enabled Ethernet MACs.
  • Compute Acceleration  On‑device RAM and dense logic enable hardware acceleration for DSP, packet processing, and custom compute kernels.
  • Data Center Infrastructure  Applicable to high‑bandwidth aggregation, PCI Express bridging, and modular I/O subsystems in data center equipment.

Unique Advantages

  • High logic and memory integration: 1,100,000 logic elements and over 112 million RAM bits reduce the need for external memory and support complex on‑chip processing.
  • Flexible high‑speed connectivity: Dual‑mode transceiver support and up to 144 transceiver channels at the series level enable versatile protocol and physical-layer interfaces.
  • Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in thermally challenging and industrial environments.
  • Compact, high‑density package: 1760‑FBGA (42.5×42.5) package provides a high pin‑count solution in a compact footprint for dense system boards.
  • Power‑aware core supply: Core voltage range of 820–880 mV allows designers to align power delivery and thermal planning with device requirements.
  • Series-level hardened IP: Built‑in support for PCIe Gen3 and 10/25/100 GbE MACs streamlines implementation of standard interfaces.

Why Choose 1ST110EN2F43I2LGAS?

The 1ST110EN2F43I2LGAS brings the Stratix 10 TX family’s high-density programmable fabric and series-level high-speed transceiver capabilities into an industrial-grade FPGA package. Its combination of 1,100,000 logic elements, extensive on‑chip RAM, and a 440‑pin I/O count makes it suited for systems that demand substantial on‑chip processing, large buffers, and robust I/O connectivity.

This device is ideal for engineers building high‑bandwidth networking, telecommunications, and compute acceleration platforms who require a scalable, high‑integration FPGA with documented series-level features such as hardened PCIe and Ethernet MAC IP, advanced transceiver modes, and secure configuration facilities.

Request a quote or submit an inquiry to get pricing, availability, and technical assistance for 1ST110EN2F43I2LGAS. Our team can provide lead‑time information and help evaluate fit for your design requirements.

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