1ST110EN2F43E2VG

IC FPGA 440 I/O 1760FBGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 1100000 1760-BBGA, FCBGA

Quantity 534 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O440Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs137500Number of Logic Elements/Cells1100000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits112197632

Overview of 1ST110EN2F43E2VG – Stratix® 10 TX FPGA, 1,100,000 logic elements, 440 I/O

The Intel Stratix® 10 TX field programmable gate array 1ST110EN2F43E2VG is a high-density FPGA offering 1,100,000 logic elements and 440 user I/O in a 1760-ball BGA package. It is built on the Stratix 10 TX device family architecture, which includes the Intel Hyperflex® core architecture and high-speed transceiver capabilities.

Targeted at high-bandwidth, compute- and I/O-intensive designs, this device provides a combination of large logic capacity, substantial on-chip RAM, and family-level transceiver and hard-IP features suitable for networking, PCI Express, and other high-speed connectivity applications.

Key Features

  • Core Architecture Intel Hyperflex® core architecture (Stratix 10 TX family) delivering increased core performance compared to prior-generation devices.
  • Logic Capacity 1,100,000 logic elements for complex FPGA designs and large-scale hardware implementations.
  • On-Chip Memory 112,197,632 total RAM bits to support large buffering, packet processing, and on-chip data storage.
  • High-Speed Transceivers (Family) Stratix 10 TX family includes power-efficient, dual-mode transceivers capable of 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation for backplane, chip-to-module, and chip-to-chip links.
  • I/O 440 user I/O pins to support wide external interfaces and high port counts.
  • Hard IP (Family) Family-level support for hardened PCI Express Gen3 and multi-rate Ethernet MAC IP blocks for reduced integration effort where applicable.
  • Package & Mounting 1760-BBGA (FCBGA) supplier device package 1760-FBGA with 42.5 × 42.5 mm footprint; surface-mount mounting type.
  • Supply Voltage Core voltage range 770 mV to 970 mV as specified for device operation.
  • Operating Temperature & Grade Extended grade with an operating range of 0 °C to 100 °C.
  • Compliance RoHS compliant.

Typical Applications

  • High-speed networking equipment Use the device's family-level 10/25/100 Gbps Ethernet MAC options and high-rate transceivers for packet processing, line cards, and switch/router designs.
  • PCI Express acceleration and host interfaces Leverage hardened PCI Express Gen3 IP within the Stratix 10 TX family for accelerator cards, NICs, and server I/O expansion.
  • Backplane and chip-to-module connectivity Dual-mode transceiver support for PAM4 and NRZ enables reliable chip-to-chip and board-to-board links in complex systems.
  • High-performance compute and DSP Large logic and memory resources support compute-dense implementations and advanced DSP pipelines.

Unique Advantages

  • Very high logic density: 1,100,000 logic elements support large, integrated FPGA designs and reduce the need for multi-chip solutions.
  • Substantial on-chip RAM: 112,197,632 total RAM bits enable extensive buffering and on-chip data structures for throughput-sensitive designs.
  • Multi-rate transceiver family capability: Family-level support for up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ provides flexibility across modern serial link standards.
  • Hardened system IP (family): Integrated PCIe and Ethernet MAC options reduce development time for common system interfaces.
  • Compact, manufacturable package: 1760-ball FCBGA package (42.5 × 42.5 mm) enables high-pin-count designs with surface-mount assembly.
  • Extended temperature grade and RoHS compliance: Suitable for environments within 0 °C to 100 °C while meeting RoHS environmental requirements.

Why Choose 1ST110EN2F43E2VG?

The 1ST110EN2F43E2VG is positioned for engineers who need high logic density, significant on-chip memory, and extensive I/O in a single FPGA package. As part of the Intel Stratix 10 TX family, it brings family-level innovations—such as the Hyperflex® core architecture and high-speed dual-mode transceivers—together with the capacity required for demanding networking, compute, and connectivity functions.

This device is suitable for system designs that require scalable logic resources, robust on-chip RAM, and the potential to leverage hardened IP and transceiver technologies offered by the Stratix 10 TX family, providing a path for scalable, high-bandwidth implementations.

Request a quote or submit an inquiry to obtain pricing and availability for 1ST110EN2F43E2VG.

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