1ST110EN2F43E2VG
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 1100000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 534 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 440 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 137500 | Number of Logic Elements/Cells | 1100000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 112197632 |
Overview of 1ST110EN2F43E2VG – Stratix® 10 TX FPGA, 1,100,000 logic elements, 440 I/O
The Intel Stratix® 10 TX field programmable gate array 1ST110EN2F43E2VG is a high-density FPGA offering 1,100,000 logic elements and 440 user I/O in a 1760-ball BGA package. It is built on the Stratix 10 TX device family architecture, which includes the Intel Hyperflex® core architecture and high-speed transceiver capabilities.
Targeted at high-bandwidth, compute- and I/O-intensive designs, this device provides a combination of large logic capacity, substantial on-chip RAM, and family-level transceiver and hard-IP features suitable for networking, PCI Express, and other high-speed connectivity applications.
Key Features
- Core Architecture Intel Hyperflex® core architecture (Stratix 10 TX family) delivering increased core performance compared to prior-generation devices.
- Logic Capacity 1,100,000 logic elements for complex FPGA designs and large-scale hardware implementations.
- On-Chip Memory 112,197,632 total RAM bits to support large buffering, packet processing, and on-chip data storage.
- High-Speed Transceivers (Family) Stratix 10 TX family includes power-efficient, dual-mode transceivers capable of 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation for backplane, chip-to-module, and chip-to-chip links.
- I/O 440 user I/O pins to support wide external interfaces and high port counts.
- Hard IP (Family) Family-level support for hardened PCI Express Gen3 and multi-rate Ethernet MAC IP blocks for reduced integration effort where applicable.
- Package & Mounting 1760-BBGA (FCBGA) supplier device package 1760-FBGA with 42.5 × 42.5 mm footprint; surface-mount mounting type.
- Supply Voltage Core voltage range 770 mV to 970 mV as specified for device operation.
- Operating Temperature & Grade Extended grade with an operating range of 0 °C to 100 °C.
- Compliance RoHS compliant.
Typical Applications
- High-speed networking equipment Use the device's family-level 10/25/100 Gbps Ethernet MAC options and high-rate transceivers for packet processing, line cards, and switch/router designs.
- PCI Express acceleration and host interfaces Leverage hardened PCI Express Gen3 IP within the Stratix 10 TX family for accelerator cards, NICs, and server I/O expansion.
- Backplane and chip-to-module connectivity Dual-mode transceiver support for PAM4 and NRZ enables reliable chip-to-chip and board-to-board links in complex systems.
- High-performance compute and DSP Large logic and memory resources support compute-dense implementations and advanced DSP pipelines.
Unique Advantages
- Very high logic density: 1,100,000 logic elements support large, integrated FPGA designs and reduce the need for multi-chip solutions.
- Substantial on-chip RAM: 112,197,632 total RAM bits enable extensive buffering and on-chip data structures for throughput-sensitive designs.
- Multi-rate transceiver family capability: Family-level support for up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ provides flexibility across modern serial link standards.
- Hardened system IP (family): Integrated PCIe and Ethernet MAC options reduce development time for common system interfaces.
- Compact, manufacturable package: 1760-ball FCBGA package (42.5 × 42.5 mm) enables high-pin-count designs with surface-mount assembly.
- Extended temperature grade and RoHS compliance: Suitable for environments within 0 °C to 100 °C while meeting RoHS environmental requirements.
Why Choose 1ST110EN2F43E2VG?
The 1ST110EN2F43E2VG is positioned for engineers who need high logic density, significant on-chip memory, and extensive I/O in a single FPGA package. As part of the Intel Stratix 10 TX family, it brings family-level innovations—such as the Hyperflex® core architecture and high-speed dual-mode transceivers—together with the capacity required for demanding networking, compute, and connectivity functions.
This device is suitable for system designs that require scalable logic resources, robust on-chip RAM, and the potential to leverage hardened IP and transceiver technologies offered by the Stratix 10 TX family, providing a path for scalable, high-bandwidth implementations.
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