1ST110EN2F43E2LG

The 1ST110EN2F43E2LG is an Intel Stratix® 10 TX field programmable gate array in a 1760‑FBGA package, designed for high-bandwidth, performance‑focused system designs. It combines the Stratix 10 TX family’s HyperFlex® core architecture and advanced packaging technologies with a large logic fabric and substantial on-chip RAM to address demanding applications that require dense programmable logic, high I/O counts, and low-voltage operation.

Key Features

• Core Architecture Built on the Intel Stratix 10 TX family architecture with HyperFlex® core technology and Intel 14 nm tri‑gate (FinFET) process as described for the device family.
• Logic Capacity 1,100,000 logic elements to support large-scale programmable designs and complex logic integration.
• On‑Chip Memory 112,197,632 total RAM bits, providing extensive embedded storage for buffering, FIFOs, and on‑chip data structures.
• I/O and Interfaces 440 user I/O pins for broad external connectivity and system integration.
• High‑Speed Transceiver Technology Stratix 10 TX family devices feature power‑efficient, dual‑mode transceivers capable of PAM4 and NRZ operation (family capability described in the device overview).
• Package and Mounting 1760‑FBGA package (42.5 × 42.5 mm) in a surface‑mount form factor for board‑level integration.
• Power and Supply Core voltage supply range of 820 mV to 880 mV, enabling operation within the specified low‑voltage core domain.
• Operating Range and Grade Extended grade with operating temperature range from 0 °C to 100 °C and RoHS compliance.

Typical Applications

• High‑speed networking and data center interconnects — Leverage the Stratix 10 TX family’s dual‑mode transceiver capabilities and large logic fabric for 10/25/100 Gbps Ethernet, backplane, and chip‑to‑chip applications described in the device overview.
• Compute and acceleration — Use abundant logic elements and large on‑chip RAM to implement custom accelerators, packet processing, or data‑plane functions.
• Telecom and optical transport — Suitable for designs requiring hardened MAC/FEC IP blocks and high aggregate transceiver bandwidth as outlined for the family.

Unique Advantages

• High integration density: 1,100,000 logic elements and over 112 million RAM bits allow large designs to reside on a single FPGA, reducing board complexity.
• Extensive I/O count: 440 user I/O pins support diverse peripheral interfaces and multi‑lane serial connectivity without external multiplexing.
• Advanced family technologies: Stratix 10 TX family innovations such as HyperFlex® core architecture and heterogeneous 3D SiP transceiver tiles provide architectural advantages available in the device family documentation.
• Compact package: 1760‑FBGA (42.5 × 42.5 mm) enables dense system layouts while maintaining a surface‑mount footprint for production assembly.
• Low‑voltage core operation: Core supply range of 820–880 mV supports designs targeting modern low‑power core domains.
• Extended grade and RoHS compliance: Rated for 0 °C to 100 °C operation and RoHS compliant for a wide set of production environments.

Why Choose 1ST110EN2F43E2LG?

The 1ST110EN2F43E2LG integrates the Stratix 10 TX family’s advanced architectural features with a high logic‑element count, substantial embedded memory, and a broad I/O complement to address high‑bandwidth, compute‑intensive FPGA designs. Its packaging and power characteristics make it suitable for systems that require dense programmable logic and extensive on‑chip resources while operating within defined extended temperature limits.

This device is positioned for engineering teams building scalable, high‑performance systems—such as networking equipment, compute accelerators, and telecom infrastructure—who need verifiable device-level specifications for logic capacity, memory, I/O, supply requirements, and package form factor.

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