1ST110EN1F43I2LGAS

The 1ST110EN1F43I2LGAS is an Intel Stratix 10 TX field-programmable gate array in a 1760-ball FCBGA package. It combines a large logic fabric with extensive embedded RAM, high-speed I/O and family-level innovations such as the HyperFlex core architecture and heterogeneous transceiver tiles.

Designed for high-bandwidth systems, the Stratix 10 TX family offers dual-mode transceivers and hardened protocol IP that support demanding applications in networking, data center and high-performance compute where aggregate transceiver bandwidth and integration are critical.

Key Features

• Logic Fabric — 1,100,000 logic elements provide a high-capacity programmable fabric suitable for complex FPGA workloads.
• On-chip Memory — 112,197,632 total RAM bits of embedded memory for large buffering, packet processing and accelerator state storage.
• High‑Speed I/O — Up to 440 user I/O pins and family-level dual-mode transceivers that support up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation for chip-to-chip, module and backplane links.
• Hardened Protocol IP — Family documentation cites hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC blocks with Reed-Solomon FEC support for NRZ and PAM4 signal modes.
• Advanced Core Architecture — Intel HyperFlex core architecture (family-level) delivering higher core performance in Stratix 10 TX devices.
• Packaging and Mounting — 1760-ball BGA (FCBGA) surface-mount package, supplier package size 1760-FBGA (42.5×42.5 mm), for dense system integration.
• Power and Operating Range — Core voltage supply range 820 mV to 880 mV; operating temperature range −40 °C to 100 °C (industrial grade).

Typical Applications

• Telecommunications & Networking — High-speed transceivers and hardened Ethernet MACs enable line cards, switches and routers that require multi‑Tbps aggregate bandwidth.
• Data Center & Cloud Infrastructure — Large logic and memory resources support packet processing, acceleration and custom offload functions for servers and storage systems.
• High‑Performance Compute & Signal Processing — Dense logic fabric and extensive on-chip RAM accommodate compute- and DSP-heavy workloads that benefit from tight integration and low-latency data paths.
• Backplane and Optical Module Interfaces — Dual-mode transceivers and high I/O counts support chip-to-module and backplane connectivity in high-speed fabrics.

Unique Advantages

• High-capacity programmable fabric: 1,100,000 logic elements and 112 million+ RAM bits enable large, integrated FPGA designs without external logic proliferation.
• Dual-mode high-speed transceivers: Support for PAM4 and NRZ signal modes at family-specified data rates provides flexibility across optical, chip-to-chip and backplane links.
• Hardened protocol support: Integrated PCIe Gen3 and 10/25/100 Gbps Ethernet MAC IP reduce design effort for common high-speed interfaces.
• Industrial operating range: −40 °C to 100 °C rating supports deployment in industrial environments with wide temperature variation.
• Advanced packaging: 1760-ball FCBGA (42.5×42.5 mm) package enables dense board-level integration and ties to heterogeneous SiP transceiver tiles at the family level.

Why Choose 1ST110EN1F43I2LGAS?

The 1ST110EN1F43I2LGAS brings together a high-capacity Stratix 10 TX fabric with extensive embedded memory, broad I/O and family-level high-speed transceiver and protocol features to meet the needs of bandwidth‑intensive systems. Its industrial temperature range and FCBGA packaging make it suitable for integrated, high-performance designs in networking, data center and compute acceleration applications.

By combining large logic and memory resources with hardened IP and high-speed interfaces, this Stratix 10 TX device offers a scalable platform for designs that require tight integration of programmable logic and high-throughput I/O.

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