1ST110EN1F43I2VGAS

The 1ST110EN1F43I2VGAS is an Intel Stratix® 10 TX field-programmable gate array (FPGA) in a 1760-BBGA FCBGA package. It pairs Intel’s HyperFlex core architecture and heterogeneous packaging innovations with high logic density and extensive on-chip RAM to address demanding, high-bandwidth system designs.

This industrial-grade device is targeted at high-performance communications and compute applications that require up to 1,100,000 logic elements, 112,197,632 total RAM bits, and 440 I/O pins, while supporting low-voltage core operation and extended operating temperatures.

Key Features

• Core Architecture: Intel HyperFlex core architecture as implemented in the Stratix 10 TX family, delivering increased core performance for complex logic designs.
• Logic Capacity: 1,100,000 logic elements (LEs) to support large, high-density designs and complex system-level integration.
• On‑Chip Memory: 112,197,632 total RAM bits, enabling large buffering, packet processing, and data-path storage without immediate external memory dependence.
• Transceivers & High‑Speed I/O: Part of the Stratix 10 TX family that includes dual-mode transceivers (PAM4 and NRZ) and hardened high-speed interfaces; this device provides 440 I/O pins for external connectivity and system interfacing.
• Hard IP & System Integration: Device family documentation highlights hardened PCI Express Gen3 and multi-rate Ethernet MAC IP blocks, enabling integration of standard high-speed protocols within the FPGA platform.
• Package & Mounting: 1760‑BBGA (1760‑FBGA) package, 42.5×42.5 mm supplier device package, designed for surface-mount assembly.
• Power and Supply: Core voltage supply range from 770 mV to 970 mV, supporting low-voltage, high-performance operation.
• Operating Range & Grade: Industrial grade with an operating temperature range of –40 °C to 100 °C and RoHS compliance.

Typical Applications

• Telecommunications Infrastructure: High-speed packet processing, fronthaul/backhaul line cards and optical transport systems that benefit from plentiful logic, on-chip RAM, and high-speed transceiver capability.
• Data Center & Networking: Switches, routers, and NIC acceleration tasks that require dense logic resources, large embedded RAM, and numerous I/Os for system connectivity.
• High‑Performance Computing & Acceleration: Custom compute accelerators and data-path offload engines leveraging the device’s large logic capacity and embedded memory for algorithm implementation.
• Advanced Interface Bridging: Protocol bridging and gateway designs that map between high-speed serial interfaces and parallel or lower-speed subsystems using abundant I/O and logic resources.

Unique Advantages

• High logic density: 1,100,000 logic elements enable consolidation of large subsystems into a single device, reducing board-level complexity.
• Substantial on-chip RAM: Over 112 million bits of embedded RAM provide large internal buffers and storage for packet and data processing without immediate external memory.
• Industrial temperature range: Specified operation from –40 °C to 100 °C supports deployment in extended-environment systems.
• Compact, high-pin package: 1760‑FBGA (42.5×42.5 mm) with 440 I/Os supports dense board integration and multiple high-speed external connections.
• Low-voltage core operation: 770 mV–970 mV supply range supports modern low-power core designs and power budgeting in constrained systems.
• RoHS compliant: Conforms to RoHS requirements for environmental and regulatory conformity in many global product flows.

Why Choose 1ST110EN1F43I2VGAS?

The 1ST110EN1F43I2VGAS delivers a balance of large logic capacity, extensive embedded RAM, and broad I/O count in an industrial-grade Stratix 10 TX FPGA package. It is well suited to system designs that require high integration, significant on-chip data storage, and the ability to interface with many external signals.

Engineers building high-bandwidth communication systems, data-center acceleration platforms, or complex bridging and protocol conversion solutions can leverage this device’s specifications to consolidate functions, manage board-level complexity, and meet extended-temperature requirements for industrial deployments.

Request a quote or submit an availability inquiry to get pricing, lead time, and ordering details for 1ST110EN1F43I2VGAS.