1ST110EN1F43I2VG

The 1ST110EN1F43I2VG is an Intel Stratix 10 TX Field Programmable Gate Array (FPGA) packaged in a 1760-BBGA (1760-FBGA, 42.5×42.5 mm) surface-mount package. It delivers a high-capacity programmable fabric — 1,100,000 logic elements and 112,197,632 bits of on-chip RAM — designed for systems that require dense logic, large embedded memory, and extensive I/O.

Built on the Stratix 10 TX device family innovations, this device targets high-bandwidth applications where advanced transceivers, hardened IP blocks, and industrial-grade robustness (–40 °C to 100 °C) are required.

Key Features

• Core Architecture  Intel Hyperflex®-based Stratix 10 TX architecture with 1,100,000 logic elements for complex programmable logic implementations and high routing density.
• On-chip Memory  112,197,632 total RAM bits provide large embedded memory for buffering, packet processing, and algorithm state storage.
• High-speed I/O  440 I/O pins to support wide external interfaces and multi-lane connectivity for high-throughput system designs.
• Transceiver & Protocol Support (Series-level)  Stratix 10 TX devices include dual-mode transceivers capable of PAM4 and NRZ operation, and hardened IP such as PCIe Gen3 and 10/25/100 GbE MACs (refer to series documentation for availability and configuration options).
• DSP and Processing (Series-level)  Series-level features include hardened floating-point DSP blocks and an optional embedded quad-core 64-bit Arm Cortex‑A53 Hard Processor System (HPS) in select devices to combine programmable logic with application-class processing.
• Power and Voltage  Supported core supply voltage range of 770 mV to 970 mV for core power domain provisioning.
• Package & Mounting  1760-BBGA (FCBGA) surface-mount package with supplier package 1760-FBGA (42.5×42.5 mm) for high-density board-level integration.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C to meet industrial environmental requirements.
• Compliance  RoHS compliant.

Typical Applications

• High-speed Networking & Switching  Use the device’s extensive logic, large on-chip RAM, and series transceiver capabilities to implement packet processing, MAC offload, and line-rate networking functions.
• Telecom & Data Center Interconnect  Suitable for board- and module-level designs that require high aggregate bandwidth, transceiver flexibility, and hardened PCIe/Ethernet IP (series-level features).
• Backplane and Chip-to-Chip Connectivity  High I/O count and package density support dense interconnects and multi-lane backplane or chip-to-chip links.
• Compute Acceleration & DSP  Large logic capacity and extensive embedded RAM enable hardware acceleration for signal processing, coding/decoding, and algorithm acceleration when paired with the series’ DSP resources.

Unique Advantages

• High logic density: 1,100,000 logic elements provide the capacity to integrate complex system functions into a single device, reducing component count.
• Massive on-chip memory: 112,197,632 bits of RAM support large buffers and stateful processing without immediate dependency on external memory.
• Robust industrial operation: Rated –40 °C to 100 °C for deployment in industrial environments where temperature margins are critical.
• Compact, high-density packaging: 1760-BBGA (42.5×42.5 mm) enables high I/O and die-area efficiency for space-constrained, high-performance boards.
• Flexible power envelope: Core supply range of 770 mV to 970 mV supports targeted power provisioning and thermal design choices.
• Compliance-ready: RoHS compliance simplifies regulatory alignment for many global markets.

Why Choose 1ST110EN1F43I2VG?

The 1ST110EN1F43I2VG brings together a high-capacity Stratix 10 TX FPGA fabric with large embedded RAM and extensive I/O in a single industrial-grade surface-mount package. Its combination of 1,100,000 logic elements, 112,197,632 bits of on-chip RAM, and 440 I/Os makes it well suited to demanding designs that require dense logic, sizable memory, and significant interface bandwidth.

This device is aimed at engineering teams designing high-throughput networking, telecom, and compute-acceleration systems that need a scalable, programmable solution backed by the Stratix 10 TX family features and Intel’s device-level innovations. It delivers a balance of integration, performance capacity, and deployment temperature range that supports long-term, production-grade applications.

Request a quote or submit a pricing inquiry for 1ST110EN1F43I2VG to get availability and lead-time information for your design.