1ST110EN2F43E1VG

The 1ST110EN2F43E1VG is an Intel Stratix® 10 TX field programmable gate array provided in a 1760‑BBGA (FCBGA) package. It combines a high-performance HyperFlex® core architecture and heterogeneous transceiver tiles to address designs that require large logic capacity, extensive I/O, and high transceiver bandwidth.

Targeted at high-bandwidth, high-integration applications, this extended‑grade device features 1,100,000 logic elements, 112,197,632 total RAM bits, and dual‑mode transceiver capabilities as described in the Stratix 10 TX device family documentation.

Key Features

• Core Architecture  HyperFlex® core architecture and Intel 14 nm tri‑gate (FinFET) technology as described for the Stratix 10 TX family, delivering increased core performance for complex logic implementations.
• Logic Capacity  1,100,000 logic elements and 137,500 LABs provide the density needed for large RTL designs and complex custom logic implementations.
• High‑Density Embedded Memory  112,197,632 total RAM bits of on‑device memory for buffering, packet processing, and intermediate data storage.
• High‑Speed Transceivers  Dual‑mode transceivers (PAM4 and NRZ modes described for Stratix 10 TX devices) supporting high aggregate bandwidth for chip‑to‑chip, chip‑to‑module, and backplane links.
• Hard MAC and PCIe IP  Stratix 10 TX family includes hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks and Reed‑Solomon FEC options (as documented for the device family).
• I/O and Package  440 I/O pins in a 1760‑BBGA (1760‑FBGA, 42.5 × 42.5 mm supplier package) surface‑mount package for high‑density board integration.
• Power and Operating Range  Voltage supply range documented at 770 mV to 970 mV with an operating temperature range of 0 °C to 100 °C; device is designated as Extended grade and is RoHS compliant.
• System Integration  Monolithic core fabric integrated with heterogeneous transceiver tiles and advanced packaging technologies are part of the Stratix 10 TX device family to support high throughput system designs.

Typical Applications

• Backplane and Module Interconnects  Chip‑to‑chip, chip‑to‑module, and backplane applications that require high‑speed serial links and sizable programmable logic resources.
• High‑Bandwidth Networking  Switching, routing, and network processing functions leveraging the device family’s hardened Ethernet MAC IP and large on‑chip RAM for packet buffering and FEC.
• PCI Express‑Based Systems  Systems requiring PCI Express Gen3 hard IP for host or peripheral connectivity combined with programmable acceleration logic.
• Compute Acceleration and Data Flow  Custom datapath acceleration, DSP, and buffering tasks that benefit from extensive logic elements and large embedded RAM capacity.

Unique Advantages

• High Logic Density:  1,100,000 logic elements enable complex, large‑scale FPGA designs without partitioning across multiple devices.
• Wide On‑Chip Memory:  112,197,632 total RAM bits support deep buffering and memory‑intensive algorithms directly on the FPGA fabric.
• Extensive I/O and Packaging:  440 I/O in a 1760‑BBGA package provides a compact, high‑pin‑count solution for dense board designs.
• Family‑Level High‑Speed Transceivers:  Stratix 10 TX dual‑mode transceiver capability supports modern serial link standards for backplane and optical module interfaces.
• Extended Grade and Compliance:  Extended grade temperature rating (0 °C to 100 °C) and RoHS compliance for regulated manufacturing environments.
• Integrated System IP:  Availability of hardened PCIe and Ethernet MAC IP in the Stratix 10 TX family simplifies system integration and reduces design risk.

Why Choose 1ST110EN2F43E1VG?

The 1ST110EN2F43E1VG brings high logic capacity, substantial on‑chip RAM, and a large I/O complement in a single, surface‑mount 1760‑BBGA package. It is suited for designs that demand significant programmable logic, high aggregate transceiver bandwidth, and integrated system IP from the Stratix 10 TX device family.

Choose this device when you need an extended‑grade, high‑density FPGA that aligns with high‑bandwidth networking, PCIe‑based systems, and complex dataflow acceleration requirements. The device’s documented voltage and temperature ranges, package, and RoHS status support predictable integration into production hardware.

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