1ST110EN2F43I1VGAS

The 1ST110EN2F43I1VGAS is an Intel Stratix 10 TX FPGA in a 1760-BBGA (FCBGA) package, delivering a high-capacity programmable fabric for demanding, high-bandwidth designs. This device combines Intel Hyperflex core architecture and dual‑mode transceivers to address applications requiring large logic capacity, extensive on-chip memory, and high-speed serial connectivity.

Designed for industrial-grade operation, the device offers 1,100,000 logic elements, 112,197,632 bits of on-chip RAM and 440 I/O pins, making it suitable for systems that require substantial integration and deterministic performance across a wide temperature and low-voltage operating range.

Key Features

• Core and Architecture — Intel Hyperflex core architecture with 1,100,000 logic elements for large-scale programmable logic integration.
• On-Chip Memory — 112,197,632 total RAM bits to support large buffering, packet processing, and intermediate data storage within the FPGA fabric.
• High-Speed I/O — 440 general-purpose I/O pins to interface with mezzanine modules, memory, and peripherals.
• Dual‑Mode Transceivers — Transceivers capable of PAM4 and NRZ operation (series-level capability up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ) for chip-to-chip, chip-to-module, and backplane links.
• Hardened IP Support — Stratix 10 TX family devices are supported by hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks for common high-speed system protocols.
• Package — 1760-BBGA (1760-FBGA footprint, 42.5 × 42.5 mm) surface-mount package for high-density board designs.
• Power and Voltage — Core voltage supply range of 770 mV to 970 mV to match system power rails and optimization strategies.
• Operating Temperature — Industrial-grade temperature range of −40 °C to 100 °C for deployment in harsh environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-Bandwidth Networking and Data Center Interconnects — Use the device’s high-speed transceivers and large logic/memory resources for packet processing, switching, and aggregation systems.
• Backplane and Chip-to-Module Links — Dual-mode transceivers support PAM4 and NRZ signaling for reliable chip-to-chip and backplane communications.
• PCIe-Based Systems and Accelerators — Leverage hardened PCI Express Gen3 support in the Stratix 10 TX family to integrate with PCIe host systems and accelerator platforms.
• Telecommunications Infrastructure — Industrial temperature rating and abundant I/O make this device suitable for line cards, OTN and transport equipment that require high serial bandwidth.

Unique Advantages

• Massive Logic Capacity: 1,100,000 logic elements accommodate complex SoC-style FPGA designs and large programmable functions on a single device.
• Extensive On-Chip Memory: Over 112 million bits of RAM reduces dependency on external memory for buffering and real-time data processing.
• High-Speed SerDes Flexibility: Dual‑mode transceivers supporting PAM4 and NRZ provide flexibility for evolving high-speed link requirements.
• Industrial Temperature Support: −40 °C to 100 °C rating enables deployment in harsh or controlled industrial environments.
• High-Density I/O and Package: 440 I/O and a 1760-BBGA package provide the pin count and board-level density needed for complex system integration.
• Standards-Ready IP: Family-level support for hardened PCIe Gen3 and multi-rate Ethernet MAC IP streamlines integration with common system interfaces.

Why Choose 1ST110EN2F43I1VGAS?

The 1ST110EN2F43I1VGAS Stratix 10 TX FPGA combines large logic and memory resources with high-density I/O and dual-mode high-speed transceivers to address demanding, high-throughput designs. Its industrial temperature rating and RoHS compliance make it suitable for robust system deployments that require sustained performance across a wide range of operating conditions.

This device is appropriate for engineering teams building high-bandwidth networking equipment, telecom line cards, PCIe accelerators, and backplane-connected systems that benefit from integrated programmable logic, substantial on-chip RAM, and flexible serial connectivity.

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