1ST110EN2F43I2VG

IC FPGA 440 I/O 1760FBGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 1100000 1760-BBGA, FCBGA

Quantity 1,058 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O440Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs137500Number of Logic Elements/Cells1100000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits112197632

Overview of 1ST110EN2F43I2VG – Stratix® 10 TX Field Programmable Gate Array (FPGA) IC

The 1ST110EN2F43I2VG is a Stratix® 10 TX FPGA in a 1760-BBGA (FCBGA) package from Intel, optimized for high-density, high-bandwidth system designs. The device implements Intel's HyperFlex core architecture and Stratix 10 TX family innovations to address demanding communications, data center and high-performance compute applications that require large programmable fabric and advanced transceiver capabilities.

With 1,100,000 logic elements, large on-chip RAM, and dual-mode transceiver technology described for Stratix 10 TX devices, this part targets designs that need substantial logic capacity, extensive I/O, and industrial temperature capability for robust deployment.

Key Features

  • Core Capacity 
    1,100,000 logic elements provide substantial programmable fabric for complex digital designs and large-scale implementations.
  • On-chip Memory 
    112,197,632 total RAM bits enable large buffering, packet processing, and on-chip data storage for compute-intensive tasks.
  • I/O 
    440 I/O pins support a wide range of system interfaces and board-level integration options.
  • Transceiver and IP (Series-level) 
    Stratix 10 TX devices feature dual-mode transceivers capable of PAM4 and NRZ operation and hardened IP such as PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC blocks, as described in the device overview.
  • Power and Supply 
    Device core voltage supply range is specified at 770 mV to 970 mV for the FPGA core.
  • Package and Mounting 
    1760-BBGA (FCBGA) package, supplier device package 1760-FBGA (42.5 × 42.5 mm), surface-mount mounting type for board-level integration.
  • Temperature Grade 
    Industrial operating range from −40 °C to 100 °C for deployment in demanding environments.
  • Compliance 
    RoHS compliant.

Typical Applications

  • High-Speed Networking and Switching 
    Large logic capacity and Stratix 10 TX transceiver capabilities make the device suitable for packet processing, switching fabrics, and network function implementations.
  • Data Center and Telecom Infrastructure 
    On-chip RAM and high-density logic support acceleration, protocol processing, and aggregation tasks in data center and telecom equipment.
  • PCI Express-based Systems 
    Use in systems requiring PCI Express Gen3 connectivity and large programmable fabric for custom I/O and acceleration functions.
  • Backplane and Chip-to-Module Interconnects 
    Device I/O count and series-level transceiver performance support chip-to-chip, chip-to-module, and backplane applications.

Unique Advantages

  • High core density: 1,100,000 logic elements deliver the programmable capacity needed for complex, multi-function designs without external ASICs for many functions.
  • Large on-chip memory: 112,197,632 RAM bits reduce external memory dependency for buffering and in-line processing tasks.
  • Extensive I/O: 440 I/O pins provide flexibility to interface with high-pin-count subsystems and varied board-level peripherals.
  • Industrial temperature range: Rated for −40 °C to 100 °C, enabling deployment in a wide range of environmental conditions.
  • Advanced package: 1760-BBGA (42.5 × 42.5 mm) surface-mount package supports dense board integration and thermal/mechanical robustness.
  • Compliant and manufacturable: RoHS compliance and standard surface-mount package facilitate modern manufacturing and regulatory requirements.

Why Choose 1ST110EN2F43I2VG?

The 1ST110EN2F43I2VG balances substantial logic density, large on-chip RAM, and high I/O count within the Stratix 10 TX device family, making it well suited for engineers designing high-bandwidth, compute-intensive systems. Its industrial temperature range and standard FCBGA package support reliable deployment in production environments that require both performance and robustness.

Choosing this Stratix 10 TX device provides designers access to the family-level architectural innovations documented for Intel Stratix 10 TX devices—such as HyperFlex core architecture and high-speed transceiver technology—allowing scalable design decisions across projects that require advanced programmable logic and transceiver capabilities.

Request a quote or submit an inquiry to purchase 1ST110EN2F43I2VG and receive pricing, availability, and lead-time information for your design requirements.

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