1ST110EN2F43I2VG
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 1100000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,058 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 440 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 137500 | Number of Logic Elements/Cells | 1100000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 112197632 |
Overview of 1ST110EN2F43I2VG – Stratix® 10 TX Field Programmable Gate Array (FPGA) IC
The 1ST110EN2F43I2VG is a Stratix® 10 TX FPGA in a 1760-BBGA (FCBGA) package from Intel, optimized for high-density, high-bandwidth system designs. The device implements Intel's HyperFlex core architecture and Stratix 10 TX family innovations to address demanding communications, data center and high-performance compute applications that require large programmable fabric and advanced transceiver capabilities.
With 1,100,000 logic elements, large on-chip RAM, and dual-mode transceiver technology described for Stratix 10 TX devices, this part targets designs that need substantial logic capacity, extensive I/O, and industrial temperature capability for robust deployment.
Key Features
- Core Capacity
1,100,000 logic elements provide substantial programmable fabric for complex digital designs and large-scale implementations. - On-chip Memory
112,197,632 total RAM bits enable large buffering, packet processing, and on-chip data storage for compute-intensive tasks. - I/O
440 I/O pins support a wide range of system interfaces and board-level integration options. - Transceiver and IP (Series-level)
Stratix 10 TX devices feature dual-mode transceivers capable of PAM4 and NRZ operation and hardened IP such as PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC blocks, as described in the device overview. - Power and Supply
Device core voltage supply range is specified at 770 mV to 970 mV for the FPGA core. - Package and Mounting
1760-BBGA (FCBGA) package, supplier device package 1760-FBGA (42.5 × 42.5 mm), surface-mount mounting type for board-level integration. - Temperature Grade
Industrial operating range from −40 °C to 100 °C for deployment in demanding environments. - Compliance
RoHS compliant.
Typical Applications
- High-Speed Networking and Switching
Large logic capacity and Stratix 10 TX transceiver capabilities make the device suitable for packet processing, switching fabrics, and network function implementations. - Data Center and Telecom Infrastructure
On-chip RAM and high-density logic support acceleration, protocol processing, and aggregation tasks in data center and telecom equipment. - PCI Express-based Systems
Use in systems requiring PCI Express Gen3 connectivity and large programmable fabric for custom I/O and acceleration functions. - Backplane and Chip-to-Module Interconnects
Device I/O count and series-level transceiver performance support chip-to-chip, chip-to-module, and backplane applications.
Unique Advantages
- High core density: 1,100,000 logic elements deliver the programmable capacity needed for complex, multi-function designs without external ASICs for many functions.
- Large on-chip memory: 112,197,632 RAM bits reduce external memory dependency for buffering and in-line processing tasks.
- Extensive I/O: 440 I/O pins provide flexibility to interface with high-pin-count subsystems and varied board-level peripherals.
- Industrial temperature range: Rated for −40 °C to 100 °C, enabling deployment in a wide range of environmental conditions.
- Advanced package: 1760-BBGA (42.5 × 42.5 mm) surface-mount package supports dense board integration and thermal/mechanical robustness.
- Compliant and manufacturable: RoHS compliance and standard surface-mount package facilitate modern manufacturing and regulatory requirements.
Why Choose 1ST110EN2F43I2VG?
The 1ST110EN2F43I2VG balances substantial logic density, large on-chip RAM, and high I/O count within the Stratix 10 TX device family, making it well suited for engineers designing high-bandwidth, compute-intensive systems. Its industrial temperature range and standard FCBGA package support reliable deployment in production environments that require both performance and robustness.
Choosing this Stratix 10 TX device provides designers access to the family-level architectural innovations documented for Intel Stratix 10 TX devices—such as HyperFlex core architecture and high-speed transceiver technology—allowing scalable design decisions across projects that require advanced programmable logic and transceiver capabilities.
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