1ST110EN2F43I2LG
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 1100000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,221 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 440 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 137500 | Number of Logic Elements/Cells | 1100000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 112197632 |
Overview of 1ST110EN2F43I2LG – Stratix® 10 TX FPGA, 1,100,000 logic elements
The 1ST110EN2F43I2LG is an Intel Stratix® 10 TX family Field Programmable Gate Array (FPGA) in a 1760-BBGA FCBGA package. This industrial-grade device provides 1,100,000 logic elements, 112,197,632 bits of on-chip RAM, and 440 user I/Os for high-density, high-performance designs.
Stratix 10 TX family innovations referenced in the device overview include the HyperFlex core architecture and high-speed dual-mode transceivers (PAM4 and NRZ), plus hardened IP for PCI Express and Ethernet—capabilities that address demanding communications, compute acceleration, and system-in-package integration use cases.
Key Features
- Core & Logic 1,100,000 logic elements provide a high-density programmable fabric for large-scale logic integration and custom hardware acceleration.
- On-chip Memory 112,197,632 total RAM bits for buffering, packet processing, and data-path staging without requiring immediate external memory.
- I/O and Connectivity 440 user I/Os accommodate complex board-level interfaces; Stratix 10 TX family transceivers support dual-mode operation (PAM4 and NRZ) and high aggregate bandwidth as described in the device overview.
- Package and Mounting 1760-BBGA FCBGA (1760-FBGA, 42.5 × 42.5 mm) surface-mount package for high-density board designs.
- Power Core supply specified at 820 mV to 880 mV to match low-voltage FPGA core requirements.
- Operating Range Industrial temperature grade with an operating range of −40 °C to 100 °C.
- Family-level Innovations Stratix 10 TX device overview cites Intel HyperFlex core architecture, hardened floating-point DSP blocks, hardened external memory controllers, and advanced packaging (EMIB/SiP) technologies.
Typical Applications
- High-speed networking and switching Used where high aggregate transceiver bandwidth and large programmable fabric are required for packet processing and forwarding functions.
- Data center acceleration Suited for compute and storage acceleration tasks that need extensive logic, large on-chip RAM, and high I/O density.
- Telecommunications and backplane systems Applicable to systems leveraging high-speed serial links and hardened Ethernet/PCI Express IP blocks referenced in the device overview.
- Complex embedded systems Enables integration of custom hardware functions and system-level I/O in industrial equipment within the specified temperature and voltage ranges.
Unique Advantages
- High-density programmable fabric: 1,100,000 logic elements enable consolidation of large logic blocks and multiple subsystems into a single device, reducing board-level complexity.
- Substantial on-chip memory: 112,197,632 bits of RAM support deep buffering and on-chip data manipulation to improve throughput and reduce external memory bandwidth dependence.
- Versatile I/O and transceiver capability: 440 I/Os and family-level support for dual-mode high-speed transceivers address diverse interface requirements from board-level I/O to high-speed serial links.
- Industrial-grade thermal performance: −40 °C to 100 °C operating range supports deployment in industrial environments with wide temperature variation.
- Compact, high-ball-count package: 1760-BBGA FCBGA (42.5 × 42.5 mm) provides the pin count and connectivity needed for complex systems while maintaining a compact footprint.
- Low-voltage core operation: Core supply range of 820 mV to 880 mV aligns with modern low-voltage system power architectures.
Why Choose 1ST110EN2F43I2LG?
The 1ST110EN2F43I2LG combines a very large logic capacity and substantial on-chip memory with high I/O density and an industrial operating range, making it suitable for demanding communications, acceleration, and embedded system applications. Family-level innovations documented in the device overview—such as HyperFlex core architecture and hardened high-speed interfaces—illustrate the platform capabilities available to designers selecting a Stratix 10 TX solution.
This part is appropriate for engineering teams targeting high-performance, integrated FPGA solutions that require scalable logic resources, robust thermal tolerance, and a dense package for complex board designs. Its specification set supports long-term system scalability and integration within ecosystems that leverage Stratix 10 TX family features.
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