1ST110EN3F43E3VG

The 1ST110EN3F43E3VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) offered in a 1760-BBGA FCBGA package. It delivers a high-density fabric with 1,100,000 logic elements and high I/O count, targeting bandwidth- and compute-intensive system designs.

As a member of the Stratix 10 TX family, this device leverages the family’s HyperFlex® core architecture and high-speed transceiver capabilities to address applications requiring large logic capacity, substantial on-chip RAM, and multi-gigabit serial connectivity.

Key Features

• Core architecture  Intel Stratix 10 TX family HyperFlex® core architecture (family-level feature) designed for high-performance FPGA implementations.
• Logic resources  1,100,000 logic elements and 137,500 logic modules for large-scale logic integration and complex system implementations.
• On-chip memory  112,197,632 total RAM bits to support large buffering, cache and high-throughput data paths.
• High-speed I/O  440 I/O pins to support wide parallel interfaces and flexible board-level connectivity.
• Dual-mode transceiver capability (family)  Stratix 10 TX devices support dual-mode transceivers capable of 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation for chip-to-chip, chip-to-module, and backplane links (family-level capability described in the device overview).
• Package and mounting  1760-BBGA (FCBGA) package; supplier device package 1760-FBGA with a 42.5 × 42.5 mm footprint. Surface-mount device for standard PCB assembly processes.
• Voltage and power  Core voltage supply range: 770 mV to 970 mV, enabling designers to plan power delivery for the FPGA core.
• Temperature and grade  Extended grade with an operating temperature range of 0 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• High‑performance networking  Large logic capacity and family-level high-speed transceivers suit linecards, routers and switches that require multi‑Tbps aggregate bandwidth.
• Telecommunications and data transport  High on-chip RAM and extensive I/O support packet buffering, protocol processing and backplane interfaces.
• Data center acceleration  Dense logic resources and large RAM enable hardware acceleration tasks such as packet processing and custom data-path engines.
• Advanced test and measurement  High I/O count and logic density allow integration of complex signal processing and real‑time data capture functions.

Unique Advantages

• Very large logic capacity: 1,100,000 logic elements provide room for complex, system‑level integration on a single device.
• Substantial on‑chip memory: 112,197,632 RAM bits reduce dependence on external memory for buffering and intermediate storage.
• High I/O density: 440 I/O pins enable broad connectivity to peripherals, memory interfaces and board-level fabrics.
• Industrial-grade packaging: 1760-BBGA FCBGA package with a 42.5 × 42.5 mm supplier package footprint supports high‑pin‑count, high‑density board designs.
• Family-level high-speed serial options: Stratix 10 TX family transceivers (PAM4/NRZ) allow designs targeting next-generation link rates and backplane implementations.
• Design and compliance considerations: RoHS compliance and defined operating ranges (0 °C to 100 °C, 770–970 mV core supply) simplify qualification and power planning.

Why Choose 1ST110EN3F43E3VG?

The 1ST110EN3F43E3VG combines very high logic density, significant on‑chip RAM and a large I/O complement in a 1760-BBGA package, making it suitable for designers building bandwidth‑ and compute‑intensive systems. As part of the Stratix 10 TX family, it benefits from the family’s high-performance core architecture and advanced transceiver technology described in the device overview.

This device is appropriate for teams needing a highly integrated FPGA platform capable of handling large logic designs, substantial buffering requirements and extensive external connectivity while working within the specified core voltage and operating temperature ranges.

Request a quote or submit an inquiry today to discuss pricing, availability, and lead times for the 1ST110EN3F43E3VG. Our team can provide the information you need to move your design forward.