1ST110ES1F50E1VG

The 1ST110ES1F50E1VG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) from Intel, delivered in a 2397-BBGA FCBGA surface-mount package. It provides large on-chip logic and memory resources combined with a high I/O count suited for complex, integration-heavy designs.

This device is specified with 1,325,000 logic elements, 112,197,632 bits of total RAM, and 440 I/Os, and operates over a 770 mV to 970 mV supply range with an operating temperature of 0 °C to 100 °C. The part is RoHS compliant and offered in an extended grade package configuration.

Key Features

• Logic Capacity  1,325,000 logic elements provide extensive FPGA fabric for large-scale custom logic, glue logic, and algorithm implementation.
• On-Chip Memory  112,197,632 total RAM bits enable substantial data buffering, lookup tables, and memory-centric processing within the FPGA.
• I/O Count  440 programmable I/Os support wide parallel interfaces and high-pin-count system interconnects.
• Power Supply  Operates from 770 mV to 970 mV, allowing integration into power-optimized designs that require precise core voltage control.
• Package & Mounting  Supplied in a 2397-BBGA (FCBGA) surface-mount package, with supplier device package listed as 2397-FBGA, FC (50×50), for board-level surface-mount assembly.
• Operating Range & Grade  Extended grade component with an operating temperature range of 0 °C to 100 °C, suitable for a broad set of commercial and industrial-class deployments.
• Compliance  RoHS compliant to support environmentally conscious designs and regulatory requirements.

Typical Applications

• High-density logic implementations  Deploy the large logic element count for complex state machines, protocol engines, and custom datapaths requiring substantial programmable fabric.
• Memory-centric processing  Use the abundant on-chip RAM for buffering, packet processing, and local data stores that reduce external memory dependency.
• High-pin-count interface bridging  Leverage 440 I/Os to implement multi-lane interfaces, parallel buses, and board-level I/O aggregation.
• System integration and prototyping  Integrate multiple functions into a single FPGA for prototype platforms or consolidated system-on-board implementations.

Unique Advantages

• Large programmable fabric: The 1,325,000 logic elements enable consolidation of complex functions that would otherwise require multiple devices, reducing BOM and board complexity.
• Substantial on-chip RAM: 112,197,632 bits of RAM support extensive buffer and caching strategies, improving data throughput and latency-sensitive processing.
• High I/O density: 440 I/Os provide design flexibility for interfacing with numerous peripherals and wide parallel buses without external multiplexing.
• Compact surface-mount package: The 2397-BBGA FCBGA package offers a high-density physical footprint suitable for space-constrained PCBs.
• Defined operating window: The specified 770 mV–970 mV supply range and 0 °C–100 °C operating temperature make integration and thermal planning straightforward for system designers.
• RoHS compliance: Environmentally compliant component selection simplifies regulatory conformity for commercial products.

Why Choose 1ST110ES1F50E1VG?

The 1ST110ES1F50E1VG combines a very large logic element count and extensive on-chip RAM with a high I/O complement in a surface-mount FCBGA package, positioning it for designs that require significant on-chip integration and memory capacity. Its extended grade specification and defined supply/temperature ranges provide clear electrical and environmental parameters for system-level validation.

This FPGA is suitable for design teams seeking to consolidate multiple functions into a single programmable device, reduce external memory dependency, and support high-pin-count interfacing while maintaining RoHS compliance. As an Intel Stratix® 10 TX family device, it delivers the resource set required for demanding, integration-focused FPGA projects.

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