1ST110ES1F50I2LG

The 1ST110ES1F50I2LG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) IC from Intel. It delivers large-scale programmable logic combined with extensive on-chip RAM and a high I/O count for demanding designs.

With 1,325,000 logic elements, 112,197,632 total RAM bits, and 440 I/Os, this device targets applications that require high-density logic integration, significant embedded memory, and broad external connectivity within industrial-temperature environments.

Key Features

• Core Logic: 1,325,000 logic elements provide a high-density programmable fabric for complex digital functions and custom acceleration.
• On-Chip Memory: 112,197,632 total RAM bits support large buffering, data staging, and memory-intensive algorithms directly on the FPGA.
• I/O Capacity: 440 I/Os enable extensive interfacing to peripherals, sensors, or external devices, supporting multi-channel and high-pin-count designs.
• Power Supply Range: Operates with a core voltage supply from 870 mV–970 mV, matching specified power domains for the device.
• Package and Mounting: Available in a 2397-BBGA (FCBGA) supplier package (2397-FBGA, FC, 50×50) and designed for surface-mount assembly.
• Industrial Temperature Range: Rated for operation from −40 °C to 100 °C, suitable for industrial applications requiring extended temperature tolerance.
• Environmental Compliance: RoHS compliant.

Typical Applications

• Industrial Control Systems: Use the device’s large logic capacity and wide operating temperature range to implement complex control algorithms and I/O aggregation for factory and process equipment.
• High-Density Signal Processing: Leverage the substantial on-chip RAM and logic elements for buffering, parallel data processing, and real-time algorithm implementation.
• Communication and Networking Equipment: Apply the high I/O count and dense logic fabric to build multi-channel interfaces, protocol handling, and packet processing functions.

Unique Advantages

• High Integration Density: 1,325,000 logic elements reduce the need for multiple discrete devices by consolidating complex logic into a single FPGA.
• Large On-Chip Memory: 112,197,632 RAM bits enable substantial in-device storage for data buffering and algorithm state, minimizing external memory dependencies.
• Extensive I/O Capability: 440 I/Os provide flexibility for multi-interface designs and high-pin-count connectivity without external multiplexing.
• Industrial Temperature Qualification: Rated from −40 °C to 100 °C for reliable operation across a broad range of industrial environments.
• Surface-Mount, High-Pin Package: The 2397-BBGA (FCBGA) package and 50×50 supplier footprint support compact board layouts with high interconnect density.
• RoHS Compliant: Meets RoHS requirements for environmental and regulatory conformity.

Why Choose 1ST110ES1F50I2LG?

The 1ST110ES1F50I2LG positions itself as a high-capacity Stratix® 10 TX FPGA suitable for designs that demand a combination of large programmable logic, substantial on-chip RAM, and numerous I/Os within an industrial temperature envelope. Its package and surface-mount form factor support dense PCB implementations while maintaining broad external connectivity.

This device is well suited to engineering teams building complex control, signal processing, or communications systems that require scalable logic resources, significant embedded memory, and robust operation across −40 °C to 100 °C. The platform-level capabilities translate into reduced BOM complexity and concentrated system functionality on a single FPGA.

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