1ST110ES2F50E2VG

The 1ST110ES2F50E2VG is a Stratix® 10 TX FPGA from Intel, delivered in a 2397-BBGA FCBGA package for surface-mount board integration. The device provides a very large logic capacity and substantial on-chip memory, alongside a high I/O count and defined operating and power ranges.

Its combination of 1,325,000 logic elements, 112,197,632 total RAM bits and 440 I/Os targets designs that require extensive programmable logic, significant internal RAM, and broad external connectivity while meeting extended-grade temperature requirements.

Key Features

• Core Logic  Provides 1,325,000 logic elements to support large, complex digital designs.
• On-chip Memory  112,197,632 total RAM bits for buffering, lookup tables, and data storage within the FPGA fabric.
• I/O Capacity  440 I/Os to accommodate multiple external interfaces and peripherals.
• Power Supply  Specified core voltage range of 770 mV to 970 mV to match system power rail planning.
• Package & Mounting  2397-BBGA, FCBGA package (supplier package: 2397-FBGA, FC, 50×50) designed for surface-mount placement on high-density PCBs.
• Temperature & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for applications requiring broader thermal tolerance.
• Environmental Compliance  RoHS compliant to meet environmental regulatory requirements.

Typical Applications

• High-capacity digital systems  Use where large numbers of logic elements and extensive on-chip RAM are required for complex FPGA implementations.
• I/O-intensive designs  Suitable for systems that need many external connections, leveraging the 440 I/O count for peripherals and interfaces.
• Compact, board-level integration  The 2397-BBGA surface-mount package supports high-density PCB layouts while operating across an extended temperature window (0 °C–100 °C).

Unique Advantages

• Significant on-chip resources: 1,325,000 logic elements and 112,197,632 RAM bits reduce the need for external logic and memory components.
• High external connectivity: 440 I/Os enable extensive interfacing without immediate reliance on additional I/O expanders.
• Defined power envelope: Core supply range of 770 mV–970 mV supports clear power-supply design and validation.
• Extended-grade operation: Rated 0 °C–100 °C for designs that require broader thermal tolerance than standard commercial parts.
• Compact package for dense boards: 2397-BBGA / 2397-FBGA (50×50) package facilitates space-efficient placement on modern PCBs.
• RoHS compliant: Conforms to environmental restrictions for lead-free assembly.

Why Choose 1ST110ES2F50E2VG?

The 1ST110ES2F50E2VG delivers a high level of integration with a large logic fabric, substantial on-chip RAM, and broad I/O capacity—attributes that support complex, resource-demanding FPGA designs. Packaged in a 2397-BBGA FCBGA and specified for extended-grade operation, it is positioned for applications that need dense programmable logic and reliable board-level integration.

As a member of the Intel Stratix® 10 TX family, this device is suited to design teams and procurement focused on scalable FPGA resources, clear power and thermal specifications, and compliance with RoHS requirements. Refer to the Stratix® 10 TX series documentation for system-level integration details and design considerations.

If you would like pricing or availability for 1ST110ES2F50E2VG, request a quote or submit a sourcing inquiry referencing the full part number.