1ST110ES2F50I1VG

The 1ST110ES2F50I1VG is a Stratix® 10 TX field programmable gate array (FPGA) device delivering very high logic and on-chip memory capacity in a 2397-BBGA FCBGA package. It is designed for applications that require dense programmable logic, large embedded RAM, and a high I/O count.

With 1,325,000 logic element cells and 112,197,632 total RAM bits, this industrial-grade FPGA suits system designs that demand substantial programmable resources while operating across a –40 °C to 100 °C temperature range and a low-voltage supply domain.

Key Features

• Core Logic Capacity  1,325,000 logic element cells provide large programmable fabric for complex digital designs and custom compute blocks.
• On-Chip Memory  112,197,632 total RAM bits support deep buffering, large data structures, and memory-intensive algorithms implemented on-chip.
• I/O and System Integration  440 device I/O pins enable broad peripheral connectivity and multi-channel interfacing in high-density designs.
• Package and Mounting  2397-BBGA (FCBGA) package, supplier device package listed as 2397-FBGA, FC (50×50), and surface-mount construction for board-level integration.
• Power Domain  Operates within a 770 mV to 970 mV supply range suitable for low-voltage core operation.
• Industrial Temperature Grade  Rated for –40 °C to 100 °C operation for use in industrial environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-Density Digital Signal Processing  Leverage 1,325,000 logic element cells and extensive on-chip RAM to implement complex DSP pipelines and custom accelerators.
• Network and Data Plane Acceleration  Large embedded memory and 440 I/O pins support high-throughput packet processing and custom networking functions.
• Industrial Control and Automation  Industrial-grade temperature range and robust packaging support real-time control, motion control, and large-scale sensor aggregation systems.
• System Integration and Prototyping  High logic and memory capacity in a compact FCBGA package enables integration into advanced prototypes and compute modules.

Unique Advantages

• High Logic Density: 1,325,000 logic element cells enable implementation of large algorithms and multiple parallel functions on a single device.
• Extensive On-Chip RAM: 112,197,632 RAM bits reduce external memory dependency and allow for large buffers and state storage inside the FPGA.
• Broad I/O Capability: 440 I/O pins facilitate connectivity to a wide range of peripherals and high-speed interfaces.
• Industrial Reliability: Operates from –40 °C to 100 °C, matching industrial environmental requirements for deployment outside controlled thermal environments.
• Low-Voltage Core Operation: 770 mV to 970 mV supply range aligns with modern low-voltage power domains to support efficient system power design.
• Surface-Mount FCBGA Packaging: 2397-BBGA/2397-FBGA (50×50) packaging supports high-density PCB assembly and compact system integration.

Why Choose 1ST110ES2F50I1VG?

The 1ST110ES2F50I1VG combines very high logic density, substantial on-chip RAM, and a large I/O complement in an industrial-grade FCBGA package. It is positioned for designs that require significant programmable resources and reliable operation across wide temperature ranges.

This device is suitable for engineering teams building compute- or memory-intensive FPGA solutions where integration density, thermal robustness, and low-voltage core operation are key considerations. Its specification set supports scalable designs and long-term deployment in industrial applications.

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