1ST110ES2F50I2LG

The 1ST110ES2F50I2LG is a Stratix® 10 TX field programmable gate array (FPGA) IC from Intel, offered in a 2397-BBGA (FCBGA) package. It provides a high logic and memory capacity FPGA fabric in a surface-mount ball grid array package.

With 1,325,000 logic elements and 112,197,632 total RAM bits, plus 440 I/O, this device supports designs that require extensive on-chip logic and on-chip storage while operating across an industrial temperature range and a low-voltage supply window.

Key Features

• Core Logic  1,325,000 logic elements to implement large-scale digital designs and complex programmable functions.
• On-Chip Memory  112,197,632 total RAM bits of embedded memory for buffering, packet storage, and intermediate data processing.
• I/O Capacity  440 I/O pins to interface with external devices, memory, and high-speed peripherals.
• Power  Voltage supply range of 870 mV–970 mV to match system power domains and device power delivery requirements.
• Package & Mounting  2397-BBGA (FCBGA) package; supplier device package listed as 2397-FBGA, FC (50×50), designed for surface-mount assembly.
• Temperature & Grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance  RoHS compliant.

Unique Advantages

• High logic capacity: 1,325,000 logic elements provide the headroom to consolidate complex functions and reduce the need for multiple FPGAs.
• Substantial on-chip memory: 112,197,632 total RAM bits support large buffers and localized data storage, reducing external memory traffic.
• Ample I/O availability: 440 I/O pins enable flexible interfacing with external components and subsystem integration.
• Industrial temperature resilience: Rated from −40 °C to 100 °C to support designs exposed to wide temperature ranges.
• Low-voltage operation: 870 mV–970 mV supply range aligns with modern power-optimized system architectures.
• Surface-mount FCBGA package: 2397-BBGA footprint and 50×50 supplier package support compact board layouts and high-density assembly.

Why Choose 1ST110ES2F50I2LG?

The 1ST110ES2F50I2LG combines extensive logic resources, significant on-chip memory, and broad I/O in a single industrial-grade FCBGA package. Its specifications make it suitable for designs that require dense programmable logic and substantial embedded RAM while maintaining operation across a wide temperature range and low-voltage domains.

This FPGA is positioned for engineers and procurement teams seeking a high-capacity programmable device that supports consolidation of complex digital functions, simplifies board-level integration with a compact surface-mount package, and meets RoHS environmental requirements.

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