1ST110ES2F50E1VG

The 1ST110ES2F50E1VG is a Stratix® 10 TX FPGA offered in a 2397-BBGA FCBGA package. It provides a large programmable fabric with 1,325,000 logic elements and 112,197,632 total RAM bits, combined with 440 I/O pins to support complex, dense digital designs.

Engineered for designs that require substantial on-chip logic, memory capacity, and extensive I/O, this surface-mount, extended-grade device operates across a 770 mV to 970 mV supply range and an operating temperature range of 0 °C to 100 °C. The device is RoHS compliant.

Key Features

• Programmable Logic  1,325,000 logic elements provide a large configurable fabric for implementing complex digital functions and custom architectures.
• On-Chip Memory  112,197,632 total RAM bits deliver substantial on-chip buffering and storage for data-paths, frame buffers, and memory-heavy algorithms.
• I/O Capacity  440 I/O pins support high pin-count interfacing for multi-channel connectivity, peripheral aggregation, and system-level integration.
• Power Supply Range  Operates from 770 mV to 970 mV, enabling designs that target the specified core voltage window.
• Package and Mounting  2397-BBGA, FCBGA package (supplier device package: 2397-FBGA, FC 50×50) in a surface-mount form factor for board-level integration.
• Operating Grade and Temperature  Extended-grade device rated for 0 °C to 100 °C operating temperature range.
• Regulatory  RoHS compliant.

Typical Applications

• High-density logic implementations  Large-scale programmable logic designs that require extensive logic elements for custom datapaths and specialized processing.
• Memory-intensive functions  On-chip RAM capacity suited for buffering, packet processing, and workloads needing substantial local memory.
• I/O-rich system interfaces  Designs that require numerous external connections and signal-routing options using the device’s 440 I/O pins.
• Board-level OEM integration  Surface-mount, high-pin-count package suitable for compact, high-density PCB implementations.

Unique Advantages

• Large programmable fabric: 1,325,000 logic elements enable implementation of complex, custom logic functions without immediate need for external ASICs.
• Substantial on-chip memory: 112,197,632 RAM bits reduce reliance on external memory for many data buffering and processing tasks.
• High I/O count: 440 I/O pins provide flexibility for multi-channel interfaces and system expansion.
• Compact, manufacturable package: 2397-BBGA FCBGA surface-mount package optimizes board area while supporting high pin density.
• Extended operating range: 0 °C to 100 °C rating and RoHS compliance align with common commercial and extended-temperature deployments.
• Defined supply window: 770 mV to 970 mV supply specification supports predictable power planning for the device core.

Why Choose 1ST110ES2F50E1VG?

The 1ST110ES2F50E1VG combines a very large logic element count, extensive on-chip RAM, and a high I/O complement in a single, surface-mount FCBGA package. It is positioned for engineers and system designers who need substantial programmable resources and memory capacity on-board while maintaining a compact board footprint.

For projects that require scalable, on-device logic and buffering, this FPGA offers a clear path to consolidate functions, reduce external components, and maintain predictable electrical and thermal design parameters within the specified supply and temperature ranges.

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