1ST110ES3F50E3VG

The 1ST110ES3F50E3VG is a Stratix® 10 TX field programmable gate array (FPGA) IC delivering high logic density and substantial on-chip RAM for complex digital designs. Its architecture targets applications that require large numbers of logic elements, extensive embedded memory, and a significant I/O count within a surface-mount FCBGA package.

With 1,325,000 logic elements, 112,197,632 total RAM bits, and 440 I/O pins, this device is positioned to support compute-heavy, memory-intensive, and I/O-rich system designs while operating across a 0 °C to 100 °C range and a core supply window of 770 mV to 970 mV.

Key Features

• Core Logic  1,325,000 logic elements provide high-density programmable fabric for complex algorithms, custom accelerators, and large-scale state machines.
• On-Chip Memory  112,197,632 total RAM bits enable extensive buffering, large lookup tables, and memory-centric processing without external RAM dependency.
• I/O Capacity  440 general-purpose I/O pins support dense board connectivity and multiple parallel interfaces.
• Power Supply  Core voltage operating range of 770 mV to 970 mV allows integration into systems with defined low-voltage power rails.
• Package & Mounting  2397-BBGA/FCBGA package (2397-FBGA, FC 50×50) in a surface-mount form factor facilitates high-pin-count integration on compact PCBs.
• Temperature & Grade  Extended grade operation from 0 °C to 100 °C for designs needing above-room-temperature capability without industrial-grade claims.
• Compliance  RoHS compliant to support environmentally conscious design requirements.

Typical Applications

• High-density digital processing  Use the device where large programmable logic capacity is required for custom datapaths, packet processing, or complex control logic.
• Memory-intensive designs  Leverage the extensive on-chip RAM for buffering, large lookup tables, and embedded data storage to reduce external memory dependence.
• I/O-rich systems  Deploy in applications that need many parallel interfaces or numerous signal connections, supported by 440 I/O pins.
• Custom accelerator integration  Implement hardware accelerators and specialized processing blocks that benefit from high logic and memory resources.

Unique Advantages

• High logic capacity: 1,325,000 logic elements enable large, complex FPGA designs without partitioning across multiple devices.
• Substantial on-chip memory: 112,197,632 RAM bits reduce reliance on external memory, improving latency and simplifying BOM.
• Large I/O count: 440 I/O pins simplify board-level connectivity for multi-channel or parallel-interface designs.
• Compact high-pin-count package: 2397-FBGA (50×50) FCBGA package concentrates functionality in a surface-mount form factor suitable for dense PCB layouts.
• Extended temperature grade: Rated 0 °C to 100 °C to support designs operating above ambient temperatures without implying industrial-grade qualification.
• RoHS compliance: Meets environmental compliance expectations for modern electronic assemblies.

Why Choose 1ST110ES3F50E3VG?

The 1ST110ES3F50E3VG combines very high logic element count, a large embedded memory pool, and extensive I/O in a single surface-mount FCBGA package, positioning it for demanding, memory- and logic-heavy designs. Its extended temperature range and RoHS compliance make it suitable for a broad set of commercial and industrial-adjacent applications where higher than room-temperature operation is required.

This device is well suited to engineering teams building compute- or data-intensive systems that benefit from integrated memory and high I/O density, offering a compact physical footprint and a clear specification set for power and thermal planning.

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