1ST110ES3F50I3VG

The 1ST110ES3F50I3VG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) IC from Intel, configured in a high-density 2397-BBGA FCBGA package. It delivers large programmable logic capacity, substantial on-chip memory, and a high I/O count for demanding industrial applications.

With 1,325,000 logic elements, 112,197,632 total RAM bits and 440 I/O pins, this device is targeted at industrial systems requiring significant logic integration, on-chip memory and robust operating-range support.

Key Features

• Logic Capacity  1,325,000 logic elements provide extensive resources for complex digital designs and custom logic implementation.
• On‑Chip Memory  112,197,632 total RAM bits for large buffering, data storage and on-chip memory structures.
• I/O Resources  440 available I/O pins to support wide parallel interfaces and diverse external connectivity.
• Power Supply Range  Supported supply voltage range from 770 mV to 970 mV to meet board-level power design requirements.
• Package and Mounting  2397-BBGA (FCBGA) package, supplier device package listed as 2397-FBGA, FC (50×50), designed for surface-mount assembly.
• Industrial Temperature Grade  Rated for operation from -40°C to 100°C, suitable for industrial temperature environments.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control Systems  Use the FPGA’s large logic and memory capacity to implement custom control, signal processing and interface functions in industrial equipment.
• High‑density Digital Processing  Deploy many parallel logic functions and on-chip memory blocks for complex digital signal processing and data-path implementations.
• Custom I/O and Interface Integration  Leverage 440 I/O pins to consolidate and manage multiple external interfaces within a single programmable device.

Unique Advantages

• Large Logic Resource: 1,325,000 logic elements enable extensive custom logic and highly parallel architectures within one device.
• Significant On‑Chip Memory: 112,197,632 total RAM bits reduce dependence on external memory for many buffering and storage tasks.
• High I/O Count: 440 I/O pins support broad connectivity requirements and complex board-level interfacing.
• Industrial‑Grade Temperature Range: Specified operation from -40°C to 100°C for deployments in thermally demanding environments.
• Dense BGA Packaging: 2397-BBGA (50×50) FCBGA package provides a compact, surface-mount form factor for high-density system designs.
• RoHS Compliant: Conforms to RoHS requirements for environmental and regulatory considerations.

Why Choose 1ST110ES3F50I3VG?

The 1ST110ES3F50I3VG positions itself as a high-capacity, industrial-grade Stratix® 10 TX FPGA that combines extensive logic and memory resources with a high I/O count and a compact FCBGA package. It is suited for designers and systems integrators who need large, integrated programmable resources in industrial environments.

Its combination of 1,325,000 logic elements, 112,197,632 RAM bits, 440 I/Os, and a -40°C to 100°C operating range provides scalability and robustness for complex digital designs, consolidation of interfaces and memory-intensive tasks while maintaining compliance with RoHS requirements.

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