1ST110EN3F43I3VG

The 1ST110EN3F43I3VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) in a 1760-BBGA (FCBGA) package, offering 1,100,000 logic elements and 440 I/O pins for high-density programmable logic applications. As a member of the Stratix 10 TX family, the device aligns with the series’ HyperFlex® core architecture and high‑bandwidth transceiver capabilities described in the device overview.

Designed for industrial-grade systems, this surface-mount FPGA combines large logic capacity and substantial on-chip RAM (112,197,632 total RAM bits) with a wide operating temperature range (−40 °C to 100 °C) and RoHS compliance, addressing demanding communications, compute acceleration, and high‑throughput data-path designs.

Key Features

• Logic Capacity – 1,100,000 logic elements suitable for large FPGA designs and complex system implementations.
• On‑Chip Memory – 112,197,632 total RAM bits for packet buffering, lookup tables, and deep on‑chip data structures.
• I/O – 440 device I/O pins to support wide external interfacing and high pin-count connectivity.
• Package & Mounting – 1760‑BBGA (FCBGA) / 1760‑FBGA (42.5 × 42.5 mm) package in a surface‑mount form factor for high-density board integration.
• Voltage Range – Core supply range 770 mV to 970 mV, enabling defined power design and domain planning.
• Temperature & Grade – Industrial grade with an operating temperature range of −40 °C to 100 °C for use in industrial environments.
• Series Innovations – As part of the Stratix 10 TX family, the device is associated with HyperFlex® core architecture, dual‑mode high‑speed transceivers (PAM4/NRZ), hardened PCIe Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks, and advanced 14 nm FinFET implementation as described in the device overview.
• Compliance – RoHS compliant, supporting environmental and regulatory requirements.

Typical Applications

• High‑speed Networking & Telecom – Use the device’s large logic fabric and series transceiver capabilities for line cards, switches, and packet processing systems requiring high aggregate bandwidth.
• Data Center & Cloud Infrastructure – Implement hardware acceleration, protocol offload, and custom data‑path logic that benefit from 1,100,000 logic elements and extensive on‑chip memory.
• Backplane and Module Interconnects – Support chip‑to‑chip, chip‑to‑module, and backplane interfaces leveraging high I/O count and family transceiver features for next‑generation interconnects.
• High‑Performance Compute & DSP – Deploy complex signal processing and compute kernels across a large programmable fabric with substantial RAM resources.

Unique Advantages

• High Logic Density: 1,100,000 logic elements provide the scale to implement large custom accelerators and multi‑function systems on a single device.
• Substantial On‑Chip RAM: 112,197,632 total RAM bits reduce dependence on external memory for many buffering and dataset needs, simplifying system memory design.
• Robust I/O Capability: 440 I/O pins enable broad external interfacing and flexible connectivity to peripherals, transceivers, and memory subsystems.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in industrial environments with extended temperature requirements.
• Advanced Packaging: 1760‑FBGA package delivers a compact, high‑pin‑count footprint suited for dense board layouts and high-performance systems.
• Series-Level High‑Speed Features: Membership in the Stratix 10 TX family brings access to HyperFlex® architecture and high‑bandwidth transceiver technologies described in the device overview for demanding bandwidth and power targets.

Why Choose 1ST110EN3F43I3VG?

The 1ST110EN3F43I3VG positions itself as a high‑capacity, industrial‑grade FPGA option within the Stratix 10 TX family, combining 1,100,000 logic elements, over 112 million bits of on‑chip RAM, and 440 I/O for high‑density, high‑throughput designs. Its package and operating specifications enable integration into complex systems where logic scale, memory, and I/O flexibility are key.

Engineers targeting networking, data center, backplane, and compute acceleration applications will find this device suited to scalable, performance‑focused designs that leverage the Stratix 10 TX family’s architectural innovations and hardened IP blocks as documented in the device overview.

Request a quote for 1ST110EN3F43I3VG to obtain pricing, lead time, and availability details for your next high‑performance FPGA design.