1ST110EN1F43I1VG

The 1ST110EN1F43I1VG is an Intel Stratix® 10 TX FPGA in a 1760-BBGA (FCBGA) package, designed for high-bandwidth programmable applications. This device integrates a high-performance HyperFlex core architecture and a large programmable fabric—1,100,000 logic elements—with extensive on-chip memory (112,197,632 total RAM bits) and 440 I/O pins to support complex system designs.

With an industrial-grade operating range (−40 °C to 100 °C), a low-voltage core supply range (770 mV to 970 mV), and RoHS compliance, this Stratix 10 TX device targets demanding communications, networking, and high-performance compute applications where integration, I/O density, and scalable logic capacity are required.

Key Features

• Core & architecture 
  HyperFlex-based Stratix 10 TX architecture delivering series-level performance improvements for high-throughput FPGA processing.
• Logic capacity 
  1,100,000 logic elements providing ample programmable resources for complex FPGA designs and large-scale logic synthesis.
• On-chip memory 
  112,197,632 total RAM bits to support large buffering, packet processing, and state-machine implementations directly in the fabric.
• I/O density 
  440 I/O pins for high channel-count interfacing to external devices, memory, and transceiver tiles.
• Package 
  1760-BBGA (FCBGA) supplier package: 1760-FBGA with 42.5 × 42.5 mm footprint for surface-mount board designs.
• Power supply 
  Core voltage range 770 mV to 970 mV to match system power rails and regulator selections.
• Temperature and grade 
  Industrial grade, operating from −40 °C to 100 °C for deployment in industrial and infrastructure environments.
• Regulatory 
  RoHS compliant.

Typical Applications

• High-speed networking and switches 
  Use the device’s large logic capacity and abundant on-chip memory to implement packet processing, forwarding engines, and network function acceleration.
• Data center interconnect and telecom 
  High I/O count and Stratix 10 TX series transceiver capabilities (series-level) support backplane and chip-to-chip interfaces in carrier and data center equipment.
• High-performance compute acceleration 
  Deploy the FPGA fabric and large RAM resources for custom compute kernels, streaming datapaths, and hardware offload tasks.

Unique Advantages

• High programmable capacity: 1,100,000 logic elements enable large designs and advanced feature integration without external ASICs.
• Substantial on-chip memory: 112,197,632 total RAM bits reduce external memory dependence for buffering and stateful processing.
• Robust I/O integration: 440 I/O pins provide flexibility for multi-protocol interfaces, high channel counts, and dense board layouts.
• Industrial operating range: −40 °C to 100 °C supports deployment in industrial and infrastructure environments with wider thermal margins.
• Compact BGA package: 1760-BBGA (42.5 × 42.5 mm) offers a compact platform for high-density board designs.
• Regulatory readiness: RoHS compliance simplifies environmental and materials planning for manufacturing.

Why Choose 1ST110EN1F43I1VG?

The 1ST110EN1F43I1VG combines a large Stratix 10 TX FPGA fabric with extensive on-chip memory and a high I/O count in a compact 1760-BBGA package, delivering the resources needed for demanding networking, telecom, and compute acceleration designs. Its industrial temperature rating and low-voltage core range make it suitable for robust deployment in infrastructure and industrial systems.

This device is suited for engineers and system architects who need scalable logic capacity, substantial embedded memory, and dense I/O in a single-package FPGA to reduce system complexity and streamline board-level integration.

Request a quote or submit a product inquiry to receive pricing and availability information for the 1ST110EN1F43I1VG Stratix® 10 TX FPGA.