1ST085ES3F50I3XG

The 1ST085ES3F50I3XG is a Stratix® 10 TX field programmable gate array (FPGA) from Intel, designed as a high-density, high-memory programmable logic device. It integrates a large number of logic elements and substantial on-chip RAM to address designs that require significant logic capacity and memory resources.

Targeted for industrial-grade applications, this surface-mount FCBGA device combines extensive I/O, a defined low-voltage supply range, and a wide operating temperature window to support robust embedded and system-level implementations.

Key Features

• Logic Capacity — 841000 logic elements provide substantial programmable logic resources for complex digital designs.
• On-Chip Memory — 71,303,168 total RAM bits support memory-intensive functions and data buffering within the FPGA fabric.
• I/O Count — 440 I/O pins enable broad interfacing options for peripherals, sensors, and board-level signals.
• Power — Designed to operate with a core voltage supply range of 870 mV to 970 mV for defined power planning and regulation.
• Package and Mounting — Offered in a 2397-BBGA (FCBGA) package; supplier device package listed as 2397-FBGA, FC (50×50) and intended for surface-mount assembly.
• Industrial Grade — Specified grade: Industrial, with an operating temperature range of -40 °C to 100 °C for use in industrial environments.
• Regulatory — RoHS compliant, supporting environmentally constrained designs.

Typical Applications

• High-density digital processing — Leverages 841000 logic elements to implement complex custom logic, parallel processing, and specialized accelerators.
• Memory-heavy designs — Uses 71,303,168 bits of on-chip RAM for buffering, packet processing, and stateful logic without relying solely on external memory.
• Board and system I/O interfacing — 440 I/O pins provide connectivity for high-pin-count interfaces, sensor arrays, and modular expansion.
• Industrial embedded systems — Industrial-grade temperature range and RoHS compliance support deployment in factory automation and similar environments.

Unique Advantages

• High logic density: 841000 logic elements allow consolidation of multiple functions into a single FPGA, reducing system complexity and BOM count.
• Large on-chip RAM: 71,303,168 total RAM bits enable advanced buffering and stateful processing without immediate dependence on external memory devices.
• Extensive I/O: 440 I/O pins support comprehensive board-level connectivity and flexible peripheral integration.
• Industrial operating range: Rated from -40 °C to 100 °C to meet temperature requirements common in industrial deployments.
• Defined power envelope: Core voltage range of 870 mV to 970 mV facilitates precise power supply design and management on high-performance boards.
• RoHS compliant: Conforms to environmental regulations for lead-free manufacturing and global product acceptance.

Why Choose 1ST085ES3F50I3XG?

The 1ST085ES3F50I3XG positions itself for designs that demand large programmable logic capacity combined with substantial on-chip memory and abundant I/O. Its industrial-grade temperature specification and surface-mount FCBGA package make it suitable for robust embedded and system-level applications where integration and reliability matter.

Engineers and procurement teams seeking a high-density FPGA with clear electrical and environmental specifications will find this part appropriate for reducing board-level complexity, consolidating functions, and supporting long-term deployed systems.

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