1ST085ES2F50I2VG

The 1ST085ES2F50I2VG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) IC from Intel. It provides a high logic-density FPGA fabric with substantial on-chip memory and a broad I/O complement to address complex digital design requirements.

Key device attributes include 841,000 logic elements, 71,303,168 total RAM bits, 440 I/O pins, an FCBGA 2397 package option, a low-voltage supply range of 770 mV to 970 mV, and an industrial operating temperature range of -40 °C to 100 °C—delivering integration and environmental robustness for industrial designs.

Key Features

• Core Logic  Provides 841,000 logic elements for implementing complex programmable logic and custom digital functions.
• On-Chip Memory  Total RAM of 71,303,168 bits to support large buffering, state storage, and memory-intensive algorithms directly on the FPGA fabric.
• I/O Density  440 general-purpose I/O pins to accommodate wide external interfacing and parallel connectivity requirements.
• Power  Supports a device supply voltage range of 770 mV to 970 mV for compatibility with low-voltage system rails.
• Package & Mounting  Offered in a 2397-BBGA (FCBGA) package with supplier device package listed as 2397-FBGA, FC (50×50); designed for surface-mount assembly.
• Temperature & Grade  Industrial grade device specified for operation from -40 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density logic implementations  Use the 841,000 logic elements to consolidate multiple functions or replace large ASICs with programmable logic.
• Memory-intensive designs  Leverage 71,303,168 bits of on-chip RAM for buffering, data streaming, and state machines without relying solely on external memory.
• I/O-heavy interfacing  Utilize 440 I/O pins to connect multiple parallel sensors, transceivers, or custom interfaces directly to the FPGA.
• Industrial embedded systems  The industrial operating range and surface-mount FCBGA packaging support deployment in temperature-challenging environments.

Unique Advantages

• High logic density: 841,000 logic elements enable consolidation of complex functions into a single FPGA, reducing board-level component count.
• Substantial on-chip memory: 71,303,168 bits of RAM facilitate large local buffers and reduce dependency on external memory resources.
• Extensive I/O capacity: 440 I/O pins provide flexibility for parallel interfaces and complex system connectivity.
• Low-voltage operation: Support for 770 mV to 970 mV supply rails aligns with modern low-voltage system designs.
• Industrial temperature rating: Specified operation from -40 °C to 100 °C for deployment in temperature-sensitive industrial applications.
• Compact FCBGA package: 2397-ball BGA footprint with a supplier package reference of 2397-FBGA (50×50) enables high-density board integration.

Why Choose 1ST085ES2F50I2VG?

The 1ST085ES2F50I2VG combines very high logic element count with large on-chip RAM and broad I/O, packaged in a compact FCBGA footprint and rated for industrial temperatures. This balance of density, memory, and I/O makes it suitable for designs that need to integrate multiple complex functions on a single programmable device.

As a member of the Stratix® 10 TX family, this FPGA is positioned for engineers who require significant programmable resources and the environmental robustness to support industrial deployments, providing a scalable platform for advanced digital designs.

Request a quote or submit an inquiry for pricing and availability to evaluate the 1ST085ES2F50I2VG for your next design.