1ST085ES3F50E3VG

The 1ST085ES3F50E3VG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) device supplied in a 2397-BBGA FCBGA package. It delivers a large programmable fabric with 841,000 logic elements, 71,303,168 total RAM bits and 440 I/O pins for dense, configurable digital designs.

Designed for surface-mount assembly and specified as Extended grade, the device operates with a core supply range of 770 mV to 970 mV and an operating temperature range of 0 °C to 100 °C, making it suitable for applications that require substantial on-chip logic, memory and I/O resources in a high-density BGA footprint.

Key Features

• Core / Logic 841,000 logic element cells provide a large programmable fabric for implementing complex digital functions and custom logic.
• On-Chip Memory 71,303,168 total RAM bits support significant on-chip buffering, packet storage and memory-intensive logic implementations.
• I/O Capacity 440 I/O pins enable broad external interfacing and high-pin-count connectivity for peripherals, memory and interconnects.
• Package & Mounting 2397-BBGA FCBGA package (supplier device package: 2397-FBGA, FC, 50 × 50) in a surface-mount form factor for compact, high-density board integration.
• Power Specified core supply range from 770 mV to 970 mV to match platform power-rail requirements.
• Temperature & Grade Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Environmental Compliance RoHS compliant.

Unique Advantages

• High logic capacity: 841,000 logic elements enable large-scale custom logic designs and extensive parallel processing implementations.
• Substantial on-chip memory: Over 71 million RAM bits reduce dependence on external memory for buffering and state storage.
• Extensive I/O: 440 I/O pins provide flexibility for connecting high-pin-count peripherals, interfaces and multi-channel systems.
• Compact, high-density package: 2397-BBGA FCBGA (50 × 50) supports dense board layouts while providing the connectivity required by complex designs.
• Controlled power envelope: Defined supply range (770–970 mV) supports predictable power provisioning in FPGA power domains.
• Extended grade operation: Specified for 0 °C to 100 °C operation to meet a range of deployment environments.

Why Choose 1ST085ES3F50E3VG?

The 1ST085ES3F50E3VG combines a large logic fabric, significant on-chip memory and a high I/O count in a compact 2397-BBGA FCBGA package, offering a balanced platform for complex programmable designs. Its defined supply range and Extended grade temperature specification make it appropriate for projects that require predictable electrical and thermal characteristics within the specified operating window.

This device is well suited for engineers and teams that need substantial configurable resources and a high-density package footprint, with the assurance of RoHS compliance and detailed device specifications for system design and procurement.

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