1ST085ES2F50I1VG

The 1ST085ES2F50I1VG is an Intel Stratix® 10 TX Field Programmable Gate Array (FPGA) in a 2397-BBGA FCBGA package. It provides a large programmable logic resource alongside significant on-chip RAM and a high I/O count for complex digital designs.

With 841,000 logic elements, 71,303,168 total RAM bits, 440 I/O pins, industrial-grade operating temperature range, and a specified supply range of 770 mV to 970 mV, this device targets applications that require substantial logic capacity, on-chip memory, and thermal resilience.

Key Features

• Logic Capacity  Provides 841,000 logic elements for implementing large-scale programmable logic and custom digital functions.
• On-chip Memory  Includes 71,303,168 total RAM bits to support buffering, state storage, and memory-intensive processing inside the FPGA fabric.
• I/O Resources  Offers 440 I/O pins to interface with high-pin-count peripherals and complex board-level designs.
• Power Supply  Specified operating supply voltage range of 770 mV to 970 mV to match system power requirements.
• Package and Mounting  Supplied in a 2397-BBGA (2397-FBGA, FC) FCBGA package (50x50) designed for surface-mount assembly.
• Operating Temperature  Industrial operating range from −40 °C to 100 °C for deployment in thermally demanding environments.
• Regulatory  RoHS compliant.

Typical Applications

• Programmable Logic Implementations  Used to implement large-scale custom logic, state machines, and protocol engines where extensive logic resources are required.
• On-chip Memory Intensive Designs  Suitable for designs that need significant on-chip RAM for buffering, temporary storage, or high-bandwidth internal data paths.
• Industrial Control and Automation  Industrial-grade temperature range and robust packaging support deployment in factory automation and control systems.
• High-Pin-Count System Integration  High I/O count enables integration with complex multi-interface boards and peripheral arrays.

Unique Advantages

• Large Programmable Fabric: 841,000 logic elements enable complex custom logic and parallel processing architectures.
• Substantial On-Chip Memory: 71,303,168 total RAM bits reduce dependence on external memory for many buffering and storage tasks.
• High I/O Density: 440 I/Os provide flexibility for interfacing multiple peripherals or high-channel-count subsystems.
• Industrial Thermal Tolerance: −40 °C to 100 °C operating range supports deployment in thermally challenging environments.
• Compact FCBGA Packaging: 2397-BBGA / 2397-FBGA (50x50) package suited for surface-mount board integration.
• RoHS Compliant: Meets lead-free and hazardous-substance compliance expectations for many designs.

Why Choose 1ST085ES2F50I1VG?

The 1ST085ES2F50I1VG combines a very large logic element count with substantial on-chip RAM and a high I/O complement in an industrial-grade FPGA package. These characteristics make it well suited for designs that require extensive programmable resources, significant internal memory, and reliable operation across a wide temperature range.

This device is appropriate for engineering teams building complex digital systems that demand integration of logic, memory, and I/O in a single programmable device while maintaining industrial thermal margins and surface-mount packaging compatibility.

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