1ST085ES2F50E1VG

The 1ST085ES2F50E1VG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) IC from Intel designed for high-density, programmable logic implementations. With 841,000 logic elements and 71,303,168 total RAM bits, it targets designs that require substantial on-chip logic and memory resources.

Packaged in a 2397-BBGA FCBGA (2397-FBGA, FC 50×50) surface-mount package and specified for an operating range of 0 °C to 100 °C, this extended-grade device provides a compact, high-capacity option for systems with significant I/O, memory, and integration needs.

Key Features

• Logic Capacity — 841,000 logic elements to implement large-scale programmable logic and complex digital functions.
• On‑Chip Memory — 71,303,168 total RAM bits for buffering, packet or data storage, and memory-intensive algorithms.
• I/O Resources — 440 I/O pins to support extensive peripheral, interface, and board-level connectivity.
• Power Supply Range — Operates with a core voltage supply between 770 mV and 970 mV to match platform power architectures.
• Package & Mounting — 2397-BBGA FCBGA (2397-FBGA, FC 50×50) in a surface-mount configuration for compact board-level integration.
• Operating Conditions — Extended grade device with a specified operating temperature range of 0 °C to 100 °C.
• Compliance — RoHS compliant.

Typical Applications

• Data processing and acceleration — On-chip memory and large logic capacity enable buffering and implementation of data-path accelerators and custom processing engines.
• Communications and networking — High I/O count and dense logic are suitable for protocol handling, packet processing, and interface aggregation.
• Prototyping and system validation — Programmable logic capacity supports complex prototypes and iterative hardware/software integration tasks.
• High-density control systems — Large logic and memory resources allow implementation of multi-channel control, monitoring, and signal processing functions.

Unique Advantages

• Substantial logic resources: 841,000 logic elements provide the capacity to implement large, integrated digital designs on a single device.
• Significant on-chip RAM: 71,303,168 total RAM bits reduce reliance on external memory for many buffering and data handling tasks.
• High I/O availability: 440 I/O pins enable broad system and board-level interfacing without extensive I/O expansion.
• Compact, manufacturable package: 2397-BBGA FCBGA surface-mount package supports dense PCB layouts and production-friendly assembly.
• Extended operating range: 0 °C to 100 °C grade fits designs targeting general commercial and extended-temperature environments.
• Regulatory compliance: RoHS compliance supports environmental and assembly requirements.

Why Choose 1ST085ES2F50E1VG?

The 1ST085ES2F50E1VG combines very large logic capacity, extensive on-chip RAM, and a high I/O count in a compact FCBGA package. It is positioned for designs that require integrated, high-density programmable logic and substantial local memory while maintaining a surface-mount form factor for production boards.

This device is suitable for customers building complex digital systems where logic scale, memory capacity, and I/O density are primary selection criteria. Its extended-grade temperature range and RoHS compliance contribute to long-term manufacturability and platform sustainability.

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