1ST085ES2F50E2LG

The 1ST085ES2F50E2LG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 2397-BBGA FCBGA package. It combines high logic capacity, substantial on-chip RAM, and a large I/O count to address demanding programmable logic requirements.

Engineered for designs that require extensive programmable resources, this extended-grade device is specified with a defined operating temperature range and a low-voltage core supply range, enabling predictable integration into high-density digital systems.

Key Features

• Logic Capacity  Provides 841,000 logic elements for implementing complex digital functions and large-scale programmable designs.
• On-Chip Memory  Includes 71,303,168 total RAM bits to support buffering, algorithm acceleration, and data-path storage within the FPGA fabric.
• I/O Density  440 I/O pins to support broad external interfacing and parallel connectivity requirements.
• Package & Mounting  2397-BBGA (FCBGA) package; supplier device package listed as 2397-FBGA, FC (50×50). Surface-mount mounting type simplifies board-level assembly for high-density designs.
• Power  Core voltage supply specified from 870 mV to 970 mV for integration with low-voltage power architectures.
• Temperature Range  Rated for operation from 0 °C to 100 °C, suitable for extended-grade applications within that ambient range.
• Regulatory  RoHS compliant, meeting common lead-free and restricted-substance requirements.

Typical Applications

• High-density digital logic  Implement large, complex logic functions where hundreds of thousands of logic elements and extensive on-chip RAM are required.
• Data buffering and on-chip memory acceleration  Use the 71,303,168 RAM bits for packet buffering, FIFO structures, or algorithmic working memory.
• High-pin-count interfacing  Leverage 440 I/Os for parallel buses, multi-lane interfaces, or multi-device interconnect on dense PCBs.

Unique Advantages

• Large configurable fabric: 841,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing system component count.
• Substantial on-chip RAM: 71,303,168 total RAM bits provide significant internal storage to accelerate data-paths and reduce external memory dependency.
• High I/O count: 440 I/Os support complex external connectivity and flexible board-level partitioning.
• Compact, production-ready packaging: 2397-BBGA (2397-FBGA, FC 50×50) surface-mount package facilitates dense board layouts and automated assembly.
• Defined operating envelope: Extended-grade rating with 0 °C to 100 °C operating temperature and 870–970 mV core supply simplifies thermal and power budgeting.
• RoHS compliant: Conforms to common environmental and manufacturing requirements for lead-free assemblies.

Why Choose 1ST085ES2F50E2LG?

The 1ST085ES2F50E2LG positions itself as a high-capacity Stratix® 10 TX FPGA option for designs that demand a large programmable fabric, extensive on-chip memory, and substantial I/O. Its extended-grade specification, compact FCBGA package, and defined voltage and temperature ranges make it suitable for system-level integration where predictability and resource density matter.

Ideal for engineering teams consolidating multiple functions into a single programmable device, this FPGA provides the raw logic, memory, and interfacing resources needed to shorten BOM and board complexity while retaining the flexibility of a field-programmable solution.

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