1ST085ES2F50E2VG

The 1ST085ES2F50E2VG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) manufactured by Intel. It provides a high-density, reprogrammable logic platform featuring 841,000 logic elements and 71,303,168 bits of on-chip RAM for designs that require substantial programmable resources.

Packaged in a 2397-ball FCBGA (50×50) surface-mount package and rated for an operating range of 0 °C to 100 °C, this device is suited to systems that need large logic capacity, significant embedded memory, and a high number of I/O signals within a compact BGA footprint.

Key Features

• Core Logic  Provides 841,000 logic elements to implement complex digital functions and large-scale programmable logic designs.
• Embedded Memory  Includes 71,303,168 total RAM bits for on-chip buffering, state storage, and memory-intensive algorithms.
• I/O Density  Offers 440 I/O pins to support high-pin-count interfacing and multi-channel connectivity.
• Power Rail  Operates with a supply voltage range of 770 mV to 970 mV to match required core voltage domains.
• Package & Mounting  2397-ball BGA in an FCBGA format (supplier device package: 2397-FBGA, FC, 50×50) designed for surface-mount PCB assembly.
• Temperature & Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Regulatory  RoHS-compliant construction.

Typical Applications

• High-density digital processing  Systems that require large logic capacity and extensive on-chip memory for complex signal processing or algorithm implementation.
• Memory-intensive designs  Applications benefiting from substantial embedded RAM for buffering, packet storage, or large state machines.
• High I/O integration  Platforms needing many external interfaces or parallel signal channels using the device’s 440 I/O pins.

Unique Advantages

• High logic capacity: 841,000 logic elements enable implementation of large, complex hardware functions within a single device.
• Large on‑chip memory: 71,303,168 bits of RAM reduce reliance on external memory for many buffering and storage tasks.
• Extensive I/O availability: 440 I/Os support dense system-level connectivity and multiple parallel interfaces.
• Compact BGA package: 2397-ball FCBGA (50×50) delivers high pin count in a compact surface-mount form factor suitable for space-constrained PCBs.
• Extended operating range: Rated for 0 °C to 100 °C and supplied as an extended-grade device for broader environmental coverage.
• RoHS compliant: Environmentally compliant manufacturing supports regulatory requirements.

Why Choose 1ST085ES2F50E2VG?

The 1ST085ES2F50E2VG combines very large logic capacity, extensive embedded memory, and high I/O count in a single Stratix® 10 TX FPGA from Intel. Its 2397-ball FCBGA package and surface-mount mounting make it suitable where board space and pin density matter, while the extended temperature grade and RoHS compliance address deployment and regulatory considerations.

This device is well suited for designers and teams building systems that require substantial programmable resources and on-chip memory within a compact footprint, offering scalability and integration for demanding digital designs.

Request a quote or submit an inquiry to obtain pricing, availability, and assistance with evaluation or procurement of the 1ST085ES2F50E2VG.