1ST085ES2F50I2LG

The 1ST085ES2F50I2LG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) IC from Intel. It provides a high-density programmable logic platform designed for designs that require substantial logic resources, on-chip memory, and a large number of I/O connections.

With 841,000 logic elements, 71,303,168 total RAM bits and 440 I/Os, this industrial-grade FPGA targets applications where integration, deterministic supply requirements and extended operating temperature are important.

Key Features

• Core Logic Capacity  841,000 logic elements (cells) provide a high level of programmable logic resource for complex digital designs.
• On‑Chip Memory  71,303,168 total RAM bits support memory-intensive functions and buffering directly on the device.
• I/O Resources  440 I/O pins allow extensive interfacing to peripherals, sensors, and external logic.
• Power Supply  Operates with a defined supply window of 870 mV to 970 mV, enabling predictable system power planning.
• Package & Mounting  2397-BBGA / FCBGA package (supplier device package: 2397-FBGA, FC, 50×50) in a surface-mount format for dense PCB integration.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in extended-temperature environments.
• Environmental Compliance  RoHS compliant to meet commonly required environmental standards.

Typical Applications

• High‑Density Logic Systems  Use the 841,000 logic elements for complex FPGA implementations such as protocol aggregation, custom datapaths and parallel processing blocks.
• Memory‑Intensive Designs  Leverage 71,303,168 RAM bits for large on‑chip buffering, packet queues or frame storage without relying solely on external memory.
• I/O‑Rich Interface Controllers  The 440 I/Os support multi‑lane interfaces, large connector arrays and mixed-signal front‑end connections in system controllers and interface hubs.
• Industrial Control & Automation  Industrial-grade temperature rating and surface-mount FCBGA package suit factory automation and embedded control systems operating across extended temperatures.

Unique Advantages

• High Logic Integration: 841,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial On‑Chip Memory: 71,303,168 RAM bits provide headroom for buffering and state storage, simplifying external memory requirements.
• Extensive I/O Count: 440 I/Os allow flexible partitioning of signals and direct interfacing to many peripherals without additional multiplexing hardware.
• Industrial Temperature Range: Rated −40 °C to 100 °C for reliable operation in extended-temperature industrial deployments.
• Compact, Surface‑Mount FCBGA Package: 2397-FBGA, 50×50 package supports high-density PCB layouts and optimized thermal/mechanical integration.
• RoHS Compliant: Meets environmental compliance requirements for regulated markets.

Why Choose 1ST085ES2F50I2LG?

The 1ST085ES2F50I2LG balances high logic capacity, large on‑chip memory and abundant I/O in a single industrial-grade FPGA package, making it suitable for designs that require consolidation of complex functions into a single programmable device. Its defined supply window and extended operating temperature support predictable system design in demanding environments.

Manufactured by Intel and provided in a compact 2397-FBGA surface-mount package, this device is aimed at engineering teams building scalable, robust embedded systems that benefit from high integration and long-term supply chain continuity.

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