1ST085ES3F50I3VG

The 1ST085ES3F50I3VG is an Intel Stratix® 10 TX Field Programmable Gate Array offered in a 2397-ball FCBGA package (50 × 50 mm). It integrates 841,000 logic elements, 71,303,168 total RAM bits and 440 I/O to address designs that require substantial on-chip logic, memory and connectivity.

With an operating range of -40 °C to 100 °C, industrial-grade qualification and a nominal supply window of 770 mV to 970 mV, this device is targeted at systems needing high integration density, large on-chip RAM and a high I/O count in a surface-mount BGA footprint.

Key Features

• Core Logic 841,000 logic elements provide extensive programmable fabric for complex digital functions and custom logic implementations.
• On‑Chip Memory 71,303,168 total RAM bits support large buffering, lookup tables and on-chip data storage to minimize external memory requirements.
• I/O Density 440 I/O pins enable broad connectivity to interfaces, peripherals and high-channel-count designs.
• Power Supply Operates from 770 mV to 970 mV supply rails, allowing integration into designs with low-voltage power architectures.
• Package and Mounting 2397-BBGA, FCBGA (2397-FBGA, FC 50 × 50) package in a surface-mount form factor for compact board-level implementation.
• Temperature and Grade Industrial grade with an operating temperature range of -40 °C to 100 °C for deployment in temperature-challenging environments.
• Regulatory Compliance RoHS compliant for alignment with environmental and manufacturing requirements.

Typical Applications

• High-density logic implementations — Large-scale programmable designs that require hundreds of thousands of logic elements for custom processing and control.
• Memory‑intensive designs — On-chip RAM capacity well-suited for buffering, packet processing or data staging that reduces the need for external memory.
• High I/O systems — Applications requiring broad peripheral and interface connectivity leveraging the 440 available I/O pins.
• Industrial embedded systems — Deployments that benefit from industrial-grade operation and a robust temperature range.

Unique Advantages

• High logic capacity: 841,000 logic elements enable complex, custom hardware acceleration and deep feature integration on a single device.
• Large on‑chip memory: 71,303,168 RAM bits provide significant internal storage to optimize data flow and reduce external memory overhead.
• Extensive I/O: 440 I/O pins support multi-channel interfaces and flexible connectivity options for system-level integration.
• Industrial operating range: Rated from -40 °C to 100 °C to accommodate designs exposed to wide temperature variations.
• Compact BGA package: 2397-ball FCBGA (50 × 50 mm) enables high-density board designs while supporting surface-mount assembly.
• RoHS compliant: Conforms to environmental manufacturing standards for streamlined production and compliance.

Why Choose 1ST085ES3F50I3VG?

1ST085ES3F50I3VG combines very large programmable logic resources, substantial on-chip RAM and a high I/O count in a single industrial-grade FCBGA package, making it well suited for systems that demand integration and scalability at the silicon level. Its electrical and thermal specifications align with designs that require compact, high-capacity FPGA resources in temperature-challenging environments.

This device fits engineering teams building complex embedded platforms that prioritize on-chip memory, extensive logic fabric and wide I/O connectivity, offering a pathway to reduce external components and consolidate system functionality while maintaining industry-standard environmental compliance.

Request a quote or submit a pricing inquiry to evaluate 1ST085ES3F50I3VG for your next design.