1ST110EN1F43E2VG

The 1ST110EN1F43E2VG is an Intel Stratix® 10 TX field‑programmable gate array supplied in a 1760‑BBGA (1760‑FBGA, 42.5×42.5 mm) package. It integrates a high‑performance FPGA fabric based on the HyperFlex® core architecture together with high‑speed transceiver capabilities and hardened interface IP described for the Stratix 10 TX family.

Targeted at high‑bandwidth communications and compute‑intensive designs, the device combines 1,100,000 logic elements, large on‑chip RAM capacity, dual‑mode transceivers, and support for embedded processing in select devices to address demanding networking, backplane, and PCI Express applications.

Key Features

• Logic Capacity  1,100,000 logic elements for implementing complex digital systems and large custom datapaths.
• On‑chip Memory  112,197,632 total RAM bits to support buffering, look‑up tables, and high‑throughput data processing.
• High‑speed I/O  440 user I/O pins to connect to peripherals, external memory, and high‑speed interfaces.
• Dual‑mode Transceivers  Stratix 10 TX devices feature dual‑mode transceivers capable of 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation (series capability cited in device overview).
• Hardened Interface IP  Includes hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks described for the Stratix 10 TX family.
• Advanced Core Architecture  Intel HyperFlex® core architecture (as described in the device overview) delivering improved core performance for the series.
• Packaging and Mounting  Surface‑mount 1760‑BBGA package (1760‑FBGA footprint 42.5×42.5 mm) for high‑density board designs.
• Power and Operating Range  Supply voltage range 770 mV to 970 mV; operating temperature 0°C to 100°C (extended grade).
• Environmental Compliance  RoHS compliant.

Typical Applications

• High‑bandwidth networking equipment  Use the device’s hardened Ethernet MACs and high‑speed transceivers for switching, routing, and transport line cards.
• Backplane and module interconnect  Dual‑mode transceivers supporting PAM4 and NRZ enable chip‑to‑chip, chip‑to‑module, and backplane communications.
• PCI Express systems  Integrate the device where hardened PCI Express Gen3 x16 implementations are required for host or accelerator connectivity.
• Embedded processing platforms  Select Stratix 10 TX devices include an embedded quad‑core Cortex‑A53 HPS for application‑class processing combined with FPGA acceleration.

Unique Advantages

• High logic density: 1,100,000 logic elements enable large, complex designs without partitioning across multiple FPGAs.
• Substantial on‑chip RAM: Over 112 million bits of RAM reduce reliance on external memory for buffering and high‑speed data paths.
• Dual‑mode transceiver support: PAM4 and NRZ capability (series feature) provides flexibility for evolving link standards and high aggregate bandwidth.
• Hardened, proven interfaces: Built‑in PCIe Gen3 and multi‑rate Ethernet MAC IP simplifies integration of common high‑speed system interfaces.
• Extended temperature grade: Rated 0°C to 100°C for deployments requiring extended ambient temperature operation.
• Compact high‑pin package: 1760‑BBGA footprint provides high I/O count and thermal/mechanical suitability for dense, high‑performance boards.

Why Choose 1ST110EN1F43E2VG?

The 1ST110EN1F43E2VG brings together the Stratix 10 TX series’ HyperFlex core architecture, extensive logic and memory resources, and multi‑mode high‑speed transceivers in a single 1760‑BBGA package. Its feature set is tailored for designs that require large FPGA fabric capacity, significant on‑chip RAM, and multi‑gigabit serial connectivity with hardened interface IP.

This device is well suited for engineering teams building high‑bandwidth communications, backplane interconnect, and PCIe‑based systems that need a tightly integrated, RoHS‑compliant FPGA solution with extended temperature operation and a high I/O count.

Request a quote or submit an inquiry for pricing and availability to evaluate the 1ST110EN1F43E2VG for your next high‑performance FPGA design.