1ST110EN1F43E1VG

The 1ST110EN1F43E1VG is a Stratix® 10 TX field-programmable gate array (FPGA) offered by Intel. It combines the Stratix 10 TX family’s HyperFlex core architecture and advanced packaging approach to address high-bandwidth, programmable system requirements.

Built for bandwidth- and compute-intensive applications, this device provides 1,100,000 logic elements, 112,197,632 bits of on-chip RAM, and dual-mode high-speed transceiver capability as described for the Stratix 10 TX family—enabling designs that require large logic capacity, extensive embedded memory, and high-speed I/O.

Key Features

• Core Architecture — Implements the Intel Stratix 10 TX family’s HyperFlex core architecture for increased core performance (series-level feature stated in the device overview).
• Logic Capacity — 1,100,000 logic elements for dense, complex logic integration in a single FPGA.
• Embedded Memory — 112,197,632 total RAM bits on-chip to support large buffering, packet processing, and on-device data structures.
• High-Speed I/O — 440 device I/Os to support broad external interfacing and multi-channel system connectivity.
• Dual-Mode Transceivers (Series) — Stratix 10 TX family transceivers support both 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation for demanding chip-to-chip, module, and backplane links (family-level capability).
• Protocol IP (Series) — Family-level support includes hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC intellectual property blocks for common high-performance interfaces.
• Package — 1760-BBGA (supplier package: 1760-FBGA, 42.5 × 42.5 mm) surface-mount package suitable for high-density board designs.
• Power and Thermal — Supply voltage range of 770 mV to 970 mV and operating temperature range of 0 °C to 100 °C; device is graded as Extended.
• Regulatory — RoHS compliant.

Typical Applications

• High‑Performance Networking — Use in switches, routers, and line cards where large logic density, extensive on-chip RAM, and high-speed transceivers are required for packet processing and protocol offload.
• Data Center Acceleration — FPGA-based acceleration for compute and storage tasks that benefit from dense logic and large embedded RAM for buffering and custom accelerators.
• Telecommunication Equipment — Backplane and module-level applications leveraging the Stratix 10 TX family’s dual-mode transceivers and hardened Ethernet/PCIe IP.
• High‑Bandwidth Board-Level Systems — Integration into systems requiring many I/Os and a high-pin-count BGA package for compact, multi-channel designs.

Unique Advantages

• Large Logic Footprint: 1,100,000 logic elements allow integration of complex state machines, custom accelerators, and wide datapaths on a single device.
• Substantial On-Chip Memory: 112,197,632 bits of RAM support deep buffering and data structures without immediate dependence on external memory.
• High-Speed SerDes Capability (Family-Level): Dual-mode transceiver support for both PAM4 and NRZ enables flexible high-bandwidth link design across module and backplane topologies.
• Robust I/O Count: 440 I/Os provide extensive external connectivity, simplifying board-level partitioning and reducing the need for multiple devices.
• Compact, High-Density Package: 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) supports dense board layouts while accommodating the device’s high pin count.
• Manufacturer Technology Foundation: Built on Intel’s Stratix 10 TX family innovations—including HyperFlex core architecture and advanced packaging—providing a clear upgrade path within the family.

Why Choose 1ST110EN1F43E1VG?

This Stratix 10 TX device targets engineers who need a high-capacity, high-bandwidth programmable platform with significant on-chip RAM and extensive I/O. Its logic density and memory budget make it suitable for integration of complex logic, packet processing, and accelerator functions into a single FPGA footprint.

As part of the Stratix 10 TX family, it benefits from series-level features such as the HyperFlex architecture and advanced SerDes and protocol IP described in the device overview—offering a scalable option for projects that require a combination of logic capacity, memory, and high-speed connectivity.

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