1ST085ES3F50E3XG

The 1ST085ES3F50E3XG is an Intel Stratix® 10 TX field programmable gate array (FPGA) device providing high logic capacity and large on-chip memory. Key device parameters include 841,000 logic element cells, 71,303,168 total RAM bits, and 440 I/O pins.

Packaged in a 2397‑BBGA (FCBGA) form factor and rated as Extended grade, this FPGA operates with a core supply range of 870 mV to 970 mV and an operating temperature range of 0 °C to 100 °C. The device is RoHS compliant and intended for surface-mount applications.

Key Features

• Core Architecture 
  Stratix® 10 TX field programmable gate array (FPGA) device optimized for programmable logic implementations.
• Logic Resources 
  841,000 logic element cells for implementing large-scale, complex logic designs.
• On‑Chip Memory 
  71,303,168 total RAM bits to support extensive buffering, state storage, and memory-heavy functions on chip.
• I/O Capacity 
  440 I/O pins to support multiple external interfaces and board-level connectivity.
• Power 
  Nominal core voltage supply range of 870 mV to 970 mV for designs targeting this supply window.
• Package & Mounting 
  2397‑BBGA, FCBGA package (supplier device package listed as 2397‑FBGA, FC (50x50)) in a surface-mount format.
• Grade & Temperature 
  Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Environmental Compliance 
  RoHS compliant.

Typical Applications

• High‑density programmable logic implementations 
  Leverage 841,000 logic element cells for complex custom logic, control and state machines.
• Memory‑intensive designs 
  Use the 71,303,168 total RAM bits for large on‑chip buffers, packet storage, or deep state tables.
• Multi‑interface or high‑I/O systems 
  440 I/O pins accommodate numerous board-level connections and peripheral interfaces.

Unique Advantages

• High logic density: 841,000 logic element cells enable consolidation of complex functions into a single device.
• Large on‑chip RAM: 71,303,168 total RAM bits reduce reliance on external memory and simplify board design.
• Generous I/O count: 440 I/O pins simplify routing to multiple peripherals and external logic.
• Compact, high‑pin package: 2397‑BBGA (FCBGA) package with supplier package 2397‑FBGA, FC (50x50) supports dense PCB layouts.
• Controlled supply window: 870 mV–970 mV supply range provides clear power requirements for system design.
• Extended temperature grading: Rated 0 °C to 100 °C for applications operating within that range.

Why Choose 1ST085ES3F50E3XG?

The 1ST085ES3F50E3XG positions itself as a high-capacity Stratix® 10 TX FPGA option from Intel, combining substantial logic resources and on‑chip memory with a high I/O count and a compact FCBGA package. These measurable attributes allow designers to consolidate complex functions, reduce external memory needs, and support numerous interfaces within a single device.

This device is well suited to teams and projects that require large programmable logic capacity, significant on‑chip RAM, and robust I/O integration within the specified 0 °C to 100 °C operating range. RoHS compliance and surface-mount packaging support modern board assembly and regulatory requirements.

Request a quote or submit a pricing and availability request for part number 1ST085ES3F50E3XG to get product-specific lead time and ordering information.