1ST085ES1F50I2LG

The 1ST085ES1F50I2LG is an Intel Stratix® 10 TX Field Programmable Gate Array (FPGA) IC supplied in a 2397-BBGA FCBGA package. This device delivers high logic density and substantial on-chip memory for complex, programmable digital designs and system-level integration.

Key on-package and operational characteristics include 841,000 logic elements, 71,303,168 total RAM bits, 440 I/O pins, a 2397-BBGA (50×50) supplier package, low-voltage core operation from 870 mV to 970 mV, and an industrial operating temperature range of −40 °C to 100 °C. The device uses surface-mount mounting and is RoHS compliant.

Key Features

• Logic Capacity  841,000 logic elements for high-density programmable logic implementations.
• On-Chip Memory  71,303,168 total RAM bits to support large buffering, state storage, and on-chip data structures.
• I/O Resources  440 I/O pins to accommodate extensive external connectivity and interface options.
• Packaging  2397-BBGA, FCBGA supplier device package (2397-FBGA, FC, 50×50) for compact, high-pin-count board integration.
• Power  Core voltage supply range of 870 mV to 970 mV to match low-voltage system power domains.
• Temperature & Grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C for thermally demanding environments.
• Mounting & Compliance  Surface mount package and RoHS compliance for modern PCB assembly and regulatory requirements.

Typical Applications

• Data Acceleration and Processing  Leverage 841,000 logic elements and 71,303,168 RAM bits to implement hardware acceleration and complex data-paths on-chip.
• High-Density I/O Systems  Deploy in systems requiring large external connectivity using the device’s 440 I/O pins for multiple interfaces and peripherals.
• Industrial Systems  Suitable for industrial control and automation equipment that requires an industrial operating range (−40 °C to 100 °C) and robust surface-mount BBGA packaging.

Unique Advantages

• High Logic Density: 841,000 logic elements provide significant capacity for integrating complex functions and reducing the need for multiple devices.
• Substantial On-Chip Memory: 71,303,168 RAM bits enable large local buffers and state storage, lowering external memory dependence.
• Extensive I/O Count: 440 I/O pins allow broad external connectivity for multi-interface designs and peripheral expansion.
• Industrial Temperature Range: Specified from −40 °C to 100 °C for deployment in thermally challenging environments.
• Compact High-Pin-Count Package: 2397-BBGA (50×50) packaging supports dense PCB layouts while delivering high pin-count connectivity.
• Low-Voltage Core Operation: 870–970 mV supply range supports integration with modern low-voltage power domains.

Why Choose 1ST085ES1F50I2LG?

The 1ST085ES1F50I2LG Stratix® 10 TX FPGA combines a very high logic element count, large on-chip RAM, and a high I/O complement in a compact 2397-BBGA package. Its industrial temperature rating and RoHS compliance make it suitable for applications that require both performance and environmental robustness.

This device is well suited for engineers and procurement teams designing complex programmable systems that require scalable logic density, significant local memory, and extensive external interfacing, while maintaining compact board real estate and low-voltage operation.

If you would like pricing or availability, please request a quote or submit a quote inquiry for the 1ST085ES1F50I2LG Stratix® 10 TX FPGA.