1ST085ES1F50I1VG

IC FPGA STRATIX10TX 2397FBGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 71303168 841000 2397-BBGA, FCBGA

Quantity 12 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O440Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells841000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits71303168

Overview of 1ST085ES1F50I1VG – Stratix® 10 TX FPGA, 841000 Logic Elements, 2397-BBGA

The 1ST085ES1F50I1VG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) IC featuring 841,000 logic elements and 71,303,168 total RAM bits. It provides a high-density, programmable logic platform with a large on-chip memory footprint and a substantial I/O count for complex hardware designs.

Designed for applications that require significant logic capacity, abundant on-chip memory and extensive I/O, this device combines a compact surface-mount FCBGA package with industrial-grade operating range and low-voltage core supply requirements.

Key Features

  • Core Logic  841,000 logic elements provide substantial programmable resources for large-scale digital designs.
  • On-Chip Memory  71,303,168 total RAM bits support data buffering, intermediate storage and state machine implementations without dependence on external memory.
  • I/O Capacity  440 I/Os enable dense external device interfacing and multiple high-pin-count peripheral connections.
  • Power  Core supply range of 770 mV to 970 mV allows operation within a defined low-voltage domain.
  • Package and Mounting  2397-BBGA (FCBGA) package, supplier device package 2397-FBGA, FC (50×50), supplied in a surface-mount form factor for board-level integration.
  • Temperature Range  Industrial operating range from −40°C to 100°C for deployment in thermally demanding environments.
  • Regulatory  RoHS compliant to support environmental and material requirements.

Typical Applications

  • High-density programmable logic  Implement complex custom logic and large-scale state machines using the device's extensive logic elements and on-chip RAM.
  • Memory-intensive processing  Leverage 71,303,168 RAM bits for buffering, packet handling or data staging within hardware-accelerated pipelines.
  • Complex I/O interfacing  Use 440 I/Os for protocol bridging, multi-channel sensor interfaces or dense peripheral connectivity.
  • Industrial control and automation  Deploy in control systems that require operation across −40°C to 100°C and reliable surface-mount packaging.

Unique Advantages

  • High integration density: 841,000 logic elements and large on-chip RAM reduce dependence on external components and simplify board-level BOM.
  • Large on-chip memory: 71,303,168 RAM bits enable significant internal data storage for buffering and state retention without added memory ICs.
  • Extensive I/O count: 440 I/Os accommodate multiple interfaces and parallel connections, minimizing the need for external multiplexing.
  • Industrial temperature support: −40°C to 100°C operating range broadens deployment options in demanding environments.
  • Compact surface-mount FCBGA package: 2397-BBGA (50×50) provides a high-pin-count solution suitable for dense PCB layouts.
  • RoHS compliant: Meets material compliance expectations for environmentally conscious designs.

Why Choose 1ST085ES1F50I1VG?

The 1ST085ES1F50I1VG positions itself as a high-density Stratix® 10 TX FPGA offering substantial logic and memory resources combined with a large I/O complement and industrial temperature capability. It is suited to engineering teams building designs that require significant on-chip resources, extensive external interfacing and reliable operation across a wide temperature range.

With its FCBGA package and defined low-voltage core supply window, this device supports compact, board-level integration while delivering the capacity needed for memory- and logic-intensive FPGA implementations.

Request a quote or submit an inquiry to receive pricing and availability details for the 1ST085ES1F50I1VG.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up