1ST085ES1F50I1VG
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 71303168 841000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 12 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 440 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 841000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 71303168 |
Overview of 1ST085ES1F50I1VG – Stratix® 10 TX FPGA, 841000 Logic Elements, 2397-BBGA
The 1ST085ES1F50I1VG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) IC featuring 841,000 logic elements and 71,303,168 total RAM bits. It provides a high-density, programmable logic platform with a large on-chip memory footprint and a substantial I/O count for complex hardware designs.
Designed for applications that require significant logic capacity, abundant on-chip memory and extensive I/O, this device combines a compact surface-mount FCBGA package with industrial-grade operating range and low-voltage core supply requirements.
Key Features
- Core Logic 841,000 logic elements provide substantial programmable resources for large-scale digital designs.
- On-Chip Memory 71,303,168 total RAM bits support data buffering, intermediate storage and state machine implementations without dependence on external memory.
- I/O Capacity 440 I/Os enable dense external device interfacing and multiple high-pin-count peripheral connections.
- Power Core supply range of 770 mV to 970 mV allows operation within a defined low-voltage domain.
- Package and Mounting 2397-BBGA (FCBGA) package, supplier device package 2397-FBGA, FC (50×50), supplied in a surface-mount form factor for board-level integration.
- Temperature Range Industrial operating range from −40°C to 100°C for deployment in thermally demanding environments.
- Regulatory RoHS compliant to support environmental and material requirements.
Typical Applications
- High-density programmable logic Implement complex custom logic and large-scale state machines using the device's extensive logic elements and on-chip RAM.
- Memory-intensive processing Leverage 71,303,168 RAM bits for buffering, packet handling or data staging within hardware-accelerated pipelines.
- Complex I/O interfacing Use 440 I/Os for protocol bridging, multi-channel sensor interfaces or dense peripheral connectivity.
- Industrial control and automation Deploy in control systems that require operation across −40°C to 100°C and reliable surface-mount packaging.
Unique Advantages
- High integration density: 841,000 logic elements and large on-chip RAM reduce dependence on external components and simplify board-level BOM.
- Large on-chip memory: 71,303,168 RAM bits enable significant internal data storage for buffering and state retention without added memory ICs.
- Extensive I/O count: 440 I/Os accommodate multiple interfaces and parallel connections, minimizing the need for external multiplexing.
- Industrial temperature support: −40°C to 100°C operating range broadens deployment options in demanding environments.
- Compact surface-mount FCBGA package: 2397-BBGA (50×50) provides a high-pin-count solution suitable for dense PCB layouts.
- RoHS compliant: Meets material compliance expectations for environmentally conscious designs.
Why Choose 1ST085ES1F50I1VG?
The 1ST085ES1F50I1VG positions itself as a high-density Stratix® 10 TX FPGA offering substantial logic and memory resources combined with a large I/O complement and industrial temperature capability. It is suited to engineering teams building designs that require significant on-chip resources, extensive external interfacing and reliable operation across a wide temperature range.
With its FCBGA package and defined low-voltage core supply window, this device supports compact, board-level integration while delivering the capacity needed for memory- and logic-intensive FPGA implementations.
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